Hynix Semiconductor Inc.

Skhynix Inc.

Jae-Geun Oh

Jin-Ku Lee

Byung-Seop Hong

Heung-Jae Cho

Kwan-Yong Lim

Se-Aug Jang

Hong-Seon Yang

Hyung-Suk Lee

Sook-Joo Kim

Yong-Soo Kim

Hyo-June Kim

Hyun-Chul Sohn

Chi-Ho Kim

Hyun-Seok Kang

Mi-Ri Lee

Sun-Hwan Hwang

Jung-Ho Lee

Keum-Bum Lee

Young-Ho Lee

Jae-Sung Roh

Seung-Beom Baek

Bong-Seok Jeon

Seung-Joon Jeon

Su-Jin Chae

Min-Seon Kang

Min-Ae Ju

Hyun-Chul Shon

An electronic device includes a semiconductor memory. A method for fabricating the electronic device includes forming a first memory cell extending vertically from a surface of substrate and having a first upper portion that protrudes laterally, forming a second memory cell extending vertically from the surface of the substrate and having a second upper portion that protrudes laterally towards the first upper portion, and forming a liner layer over the first and second memory cells, the liner layer having a first portion disposed over the first upper portion and a second portion disposed over the second upper portion, the first and second portions of the liner layer contacting each other.

Electronic device and method for fabricating the same

This technology provides an electronic device and a method for fabricating the same. An electronic device in accordance with an implementation of this document may include a substrate including a first portion in a first region and a second portion in a second region; a plurality of memory cells disposed over the first portion of the substrate; a first insulating layer extending over the second portion of the substrate and at least partially filling a space between adjacent ones of the plurality of memory cells; and a second insulating layer disposed over the first insulating layer. The first insulating layer has a dielectric constant smaller than that of the second insulating layer, a thermal conductivity smaller than that of the second insulating layer, or both.

An electronic device comprising a semiconductor memory unit that includes a resistance variable element formed over a substrate, and including stacked therein a bottom electrode, a variable resistance layer and a top electrode, and a barrier layer formed over the resistance variable element, and including an amorphous silicon layer which is doped with at least one kind of impurity.

An electronic device with improved variable resistance characteristics and a method for fabricating the same are provided. In an embodiment of the disclosed technology, a method for forming an electronic device with a semiconductor memory includes forming a crystalized doped layer over a substrate; forming a barrier layer over the doped layer; forming a metal layer over the barrier layer; and reacting the barrier layer with a portion of the metal layer. The electronic device and the method of fabricating the same according to embodiments of the disclosed technology may have improved variable resistance characteristics.

A doping method that forms a doped region at a desired location of a three-dimensional (3D) conductive structure, controls the doping depth and doping dose of the doped region relatively easily, has a shallow doping depth, and prevents a floating body effect. A semiconductor device is fabricated using the same doping method. The method includes, forming a conductive structure having a sidewall, exposing a portion of the sidewall of the conductive structure, and forming a doped region in the exposed portion of the sidewall by performing a plasma doping process.

Plasma doping method and method for fabricating semiconductor device using the same

A method for fabricating a semiconductor device includes forming a plurality of bodies that are each isolated from another by a trench and each include a diffusion barrier region with a sidewall exposed to the trench, forming a doped layer gap-filling the trench, forming a sidewall junction at the exposed sidewall of the diffusion barrier region by annealing the doped layer, and forming a conductive line coupled with the sidewall junction to fill the trench.

Semiconductor device with side-junction and method for fabricating the same

A gate of a semiconductor device includes a substrate, and a polysilicon layer over the substrate, wherein the polysilicon layer is doped with first conductive type impurities having a concentration that decreases when receding from the substrate and counter-doped with second conductive type impurities having a concentration that increases when receding from the substrate.

Gate in semiconductor device and method of fabricating the same

A method for doping polysilicon improves a doping profile during plasma doping and includes forming a silicon layer using two separate operations. After forming a first silicon layer, thermal annealing is performed to crystallize the first silicon layer, such that the uniformity of a doping concentration according to the depth of a layer inside is improved during plasma doping. Additionally, a doping concentration at the interface between a polysilicon layer and a gate oxide layer is increased. A by-product deposition layer is reduced, which is formed on the surface of a polysilicon layer due to the increase of a doping concentration in a polysilicon layer. As a result, the dopant loss, which is caused by the removing and cleansing of an ion implantation barrier used during doping, is reduced.

Method for doping polysilicon and method for fabricating a dual poly gate using the same

A plasma doping method includes providing a doping source over a substrate. The doping source includes dopants that are to be injected into the substrate. At least two different bias voltages are applied to inject the dopants from the doping source to the substrate.

The present invention relates to a method for fabricating a semiconductor device with improved refresh time. The method includes the steps of: forming a plurality of gate lines on a substrate; forming a plurality of cell junctions by ion-implanting a first dopant with use of the gate lines as a mask; forming a buffer layer along a gate line profile; and forming a plurality of plug ion-implantation regions in the cell junctions by ion-implanting a second dopant into the substrate under the presence of the buffer layer to thereby from the plugs thereon.

Method for fabricating semiconductor device with improved refresh time

A gate structure of a semiconductor memory device capable of preventing a poly void generation by forming a hard mask and maintaining a hysteresis area within a certain value. The gate structure of the semiconductor memory device includes: a gate insulation layer formed on a semiconductor substrate; a gate electrode formed on the gate insulation layer, wherein the gate electrode is formed by stacking a polysilicon layer and a metal layer; and a hard mask formed on the gate electrode, wherein a hysteresis area between the hard mask and the gate electrode materials is a equal to or less than approximately 2&#xd7;10&#xb0; C.-dyne/cm.

Gate structure of semiconductor memory device

The present invention provides a method for fabricating a semiconductor device having a dual gate dielectric structure capable of obtaining a simplified process and improving device reliability. The method includes the steps of: forming an insulation layer on a substrate; forming a nitride layer on the insulation layer; selectively etching the nitride layer in a predetermined region of the substrate; performing a radical oxidation process to form an oxide layer on the insulation layer and the etched nitride layer; forming a gate conductive layer on the oxide layer; and performing a selective etching process to the gate conductive layer, the oxide layer, the nitride layer and the insulation layer, so that the first dielectric structure formed in the predetermined region includes the insulation layer and the oxide layer and the second gate dielectric structure formed in regions other than the predetermined region includes the insulation layer, the nitride layer and the oxide layer.

Growing community of inventors

Ichon-shi, South Korea

Jae-Geun Oh