Samsung Electro-mechanics Co., Ltd.

Jae-Choon Cho

Choon-Keun Lee

Sang-Moon Lee

Myeong-Ho Hong

Jeong-Bok Kwak

Jung-Woo Lee

Andreas Greiner

Keun-Yong Lee

Hwa-Young Lee

Senug-Hyun Ra

Do-Yeung Yoon

Jun-Rok Oh

Seung-Hyun Ra

Hee-Sun Chun

Moon-Soo Park

Hyuk-Soo Lee

The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.

Method for manufacturing printed circuit board including flame retardant insulation layer

The present invention relates to a poly(p-xylylene)-based polymer having a low dielectric constant suitable for low loss dielectrics (LLD), and an insulating material, a printed circuit board and a functional element using the same. More particularly, the poly(p-xylylene)-based polymer includes at least one repeat unit expressed by the following formula (1): 

[object Object]

A method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by forming conductive polymer wiring using imprinting.

Method for manufacturing printed circuit board using imprinting

A manufacturing method for imprinting stamper is disclosed. The manufacturing method includes forming a plurality of concave patterns on an insulation layer, forming a stamper by filling copper in the concave patterns, separating the stamper from the insulation layer, providing roughness on the surface of the stamper, can separate the stamper from the insulation layer, can prevent the deformation of the stamper and can manufacture pluralities of stampers repeatedly.

Manufacturing method for imprinting stamper

Growing community of inventors

Suwon-si, South Korea

Jae-Choon Cho