Samsung Electro-mechanics Co., Ltd.

Snu Rdb Foundation

Jae Choon Cho

Choon Keun Lee

Hee Sun Chun

Seung Hyun Ra

Sung Hyun Kim

Sang Moon Lee

Jeong Bok Kwak

Chi Seong Kim

Chung Hee Lee

Hyung Mi Jung

Hwa Young Lee

Jung Woo Lee

Jong Yoon Jang

Do Yeung Yoon

Il Sang Maeng

Ho Lim

Jong Su Park

Ji Young Chang

Disclosed herein are an insulating film and a producing method of the insulating film which can address problems caused by dents by providing a reinforcing layer having the weight ratio of the silica of 60 to 80 wt % on one surface of the insulating film.

Insulating film and producing method for insulating film

There are provided a conductive paste composition for an external electrode and a multilayer ceramic electronic component fabricated using the same, the conductive paste composition for an external electrode including: a conductive metal powder; and a resin mixture including at least one resin selected from a group consisting of an epoxy-based resin and a phenoxy-based resin, and a polyvinyl formal resin.

Conductive paste composition for external electrode and multilayer ceramic electronic component fabricated using the same

Disclosed herein is a curable cyclic phosphazene compound having a low dielectric constant, a low dielectric loss index and high thermal stability, and a method of preparing the same. The curable cyclic phosphozene polymer prepared using the compound has a low dielectric constant and excellent thermal properties, compared to conventional phosphozene polymers.

Curable cyclic phosphazene compound and method of preparing the same

There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.

Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the same

The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.

Method of manufacturing printed circuit board using imprinting process

Disclosed is a method of manufacturing a printed circuit board for fine circuit formation, in which an unnecessary metal layer formed on the upper portion of a circuit pattern is removed through mechanical polishing and then chemical etching. In place of expensive chemical mechanical polishing, in the method of the invention, mechanical polishing and chemical etching are continuously applied to thus sequentially remove and planarize the unnecessary metal layer. Thereby, through an inexpensive, simple, and continuous process, the planarization procedure can be precisely performed, thus making it possible to apply the method to large areas and economically realize a fine circuit pattern.

Method of manufacturing printed circuit board for fine circuit formation

Growing community of inventors

Gyunggi-do, South Korea

Jae Choon Cho