Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Other

Jae-chang Lee

Jae-woo Chung

Seung-mo Lim

Jae-hoon Lee

Geun-bae Lim

Dae-sung Yoon

Tae-woon Cha

Woon-bae Kim

Young-nam Kwon

Sung-gyu Kang

Seung-Mo Lim

Hwa-Sun Lee

Kyo-Yeol Lee

Jae-Woo Chung

A nozzle plate for an inkjet head and a method of manufacturing the nozzle plate includes a silicon substrate having a nozzle, a thermally oxidized silicon layer formed on an outer surface of the silicon substrate and an inner wall of the nozzle, an adhesion layer deposited on the thermally oxidized silicon layer formed on the outer surface of the silicon substrate and formed of silicon oxide, and an ink-repellent coating layer deposited on the adhesion layer.

Nozzle plate for inkjet head and method of manufacturing the nozzle plate

A piezoelectric ink-jet printhead and a method for manufacturing the same, wherein the piezoelectric ink-jet printhead is formed by stacking three monocrystalline silicon substrates on one another and adhering them to one another. The three substrates include an upper substrate, through which an ink supply hole is formed and a pressure chamber is formed on a bottom surface thereof; an intermediate substrate, in which an ink reservoir and a damper are formed; and a lower substrate, in which a nozzle is formed. A piezoelectric actuator is monolithically formed on the upper substrate. A restrictor, which connects the ink reservoir to the pressure chamber in flow communication, may be formed on the upper substrate or intermediate substrate.

Method for manufacturing piezoelectric ink-jet printhead

A silicon direct bonding (SDB) method by which void formation caused by gases is suppressed. The SDB method includes: preparing two silicon substrates having corresponding bonding surfaces; forming trenches having a predetermined depth in at least one bonding surface of the two silicon substrates; forming gas discharge outlets connected to the trenches on at least one of the two silicon substrates to vertically penetrate the bonding surface; cleaning the two silicon substrates; closely contacting the two silicon substrates to each other; and thermally treating the two substrates to bond them to each other. The trenches are formed along at least a part of a plurality of dicing lines, and both ends of the trenches are clogged. Gases generated during a thermal treatment process can be smoothly and easily discharged through the trenches and the gas discharge outlet such that a void is prevented from being formed in the junctions of the two silicon substrates due to the gases.

Silicon direct bonding method

A method for detecting a polymerase chain reaction (PCR) product is provided. The method includes (a) providing at least a pair of electrodes in a PCR solution-containing vessel; (b) performing PCR; (c) producing an electric field between the electrodes; and (d) measuring a change in a dielectric property in the PCR solution. Therefore, a PCR product can be detected in real time.

Method for detecting PCR product using electrical signal

Piezoelectric ink-jet printhead

Growing community of inventors

Kyungki-do, South Korea

Jae-chang Lee