Samsung Electro-mechanics Co., Ltd.

Jae Chang Lee

Tae Kyung Lee

Moon Chul Lee

Tae Yoon Kim

Hwa Sun Lee

Seung Wook Park

Tae Hun Lee

Jae Hyun Jung

Hyun Hak Kim

Seong Hun Na

Duck Hwan Kim

Yeong Gyu Lee

Jong Woon Kim

Chang Hyun Lim

Sang Uk Son

Won Jae Han

Seok Kyoon Woo

Byung Hun Kim

Yong Gil Namgung

Tah Joon Park

Seung Mo Lim

Sung Woo Han

Won Chul Sim

Hyun Ho Shin

Sung Min Cho

In Young Kang

Dae Hun Jeong

Jung Nam Lee

Jun Boum Lim

Kyong Bok Min

Jong Beom Kim

Jong Kweon Park

Jong Won Yu

Hyun Min Hwang

Wang Sang Lee

A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.

Resonator package and method of manufacturing the same

A bulk-acoustic resonator module includes: a module substrate; a bulk-acoustic resonator connected to the module substrate by a connection terminal and disposed spaced apart from the module substrate; and a sealing portion sealing the bulk-acoustic resonator. The bulk-acoustic resonator includes a resonating portion disposed opposite to an upper surface of the module substrate. A space is disposed between the resonating portion and the upper surface of the module substrate.

Bulk-acoustic resonator module

A bulk-acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a connection member connected an upper surface of the metal pad. A lower end portion of the connection member includes a tapered portion decreasing in a diameter in a direction toward a lower end of the connection member, and an angle between an inclined surface of the tapered portion and the upper surface of the metal pad is 45&#xb0; to 80&#xb0;.

Bulk-acoustic wave resonator

A semiconductor package includes a main substrate, a resonator device disposed above the main substrate, a wiring portion connected to the resonator device, an electrical connection structure connected to the wiring portion and the main substrate, an encapsulant encapsulating the resonator device and the electrical connection structure, and a heat dissipation member bonded to and mounted on the resonator device. A cavity is provided in the resonator device, and is formed between the resonance portion and a resonator device substrate provided in the resonator device.

Semiconductor package

A thin-film package includes: a substrate; a wiring layer disposed on the substrate; a microelectromechanical systems (MEMS) element disposed on a surface of the substrate; a partition wall disposed on the substrate to surround the MEMS element, and formed of a polymer material; a cap forming a cavity with the substrate and the partition wall; and an external connection electrode connected to the wiring layer. The external connection electrode includes at least one inclined portion disposed on at least one inclined surface formed on any one or any combination of any two or more of the substrate, the partition wall, and the cap.

Thin-film type package

An acoustic resonator includes: a substrate; a resonance part mounted on the substrate and including resonance part electrodes, the resonance part being configured to generate acoustic waves; a cavity disposed between the resonance part and the substrate; a frame part disposed on at least one electrode among the resonance part electrodes, and being configured to reflect the acoustic waves; and a connection electrode configured to connect the at least one electrode to an external electrode, and having a thickness less than a thickness of the at least one electrode.

Acoustic resonator and method of manufacturing the same

A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.

Bulk acoustic wave resonator device

A bulk acoustic wave (BAW) resonator includes: a substrate; a first BAW resonator including a first air cavity disposed in the substrate, and further including a first electrode, a first piezoelectric layer, and a second electrode stacked on the first air cavity; a second BAW resonator including a second air cavity disposed in the substrate, and further including a first electrode, a second piezoelectric layer, and a second electrode stacked on the second air cavity, wherein the second BAW resonator is connected in parallel to the first BAW resonator and has polarities that are opposite of polarities of the first BAW resonator; and a compensation capacitor circuit connected between the first BAW resonator and the second BAW resonator.

BAW resonator and BAW filter for reducing harmonic distortion

A wafer level package includes a wafer member having inner cavities in which circuit elements are disposed, element wall members disposed on an internal surface of the wafer member and enclosing element sections in which the circuit elements are disposed, and clearance wall members disposed on external surfaces of the element wall members and dividing a space between the element sections into clearance sections.

Wafer level package and method of manufacturing the same

A bulk acoustic wave resonator includes: a substrate; a cavity forming layer disposed on the substrate so as to form a cavity; a lower electrode disposed on the cavity; a piezoelectric layer disposed on the lower electrode; an upper electrode disposed on the piezoelectric layer; and a temperature compensation layer disposed below the lower electrode and in the cavity portion.

Bulk acoustic wave resonator and method of manufacturing the same

There is provided a piezoelectric actuator including: a piezoelectric member having a multilayer structure; an external electrode formed on an outer surface of the piezoelectric member; and an intermediate electrode formed between layers of the piezoelectric members and having an area smaller than that of the external electrode.

Piezoelectric actuator

Disclosed herein is an angular velocity sensor including: first and second mass bodies; a first frame provided at an outer side of the first and second mass bodies; a first flexible part connecting the first and second mass bodies to the first frame in a Y axis direction, respectively; a second flexible part connecting the first and second mass bodies to the first frame in an X axis direction, respectively; a second frame provided at an outer side of the first frame; a third flexible part connecting the first and second frames to each other in the X axis direction; and a fourth flexible part connecting the first and second frames to each other in the Y axis direction, wherein the first frame has a thickness in a Z axis direction thinner than that of the second frame.

Angular velocity sensor

A piezoelectric actuator includes upper and lower electrodes providing driving voltages and a piezoelectric film formed between the upper and lower electrodes and providing a driving force to ink in a plurality of pressure chambers formed on an inkjet print head, respectively. The piezoelectric film may include a plurality of basin parts individually formed on respective tops of the plurality of pressure chambers and a large-area part connected to the plurality of basin parts, respectively, at one end of the plurality of basin parts and formed as a single body. The large-area part may include a groove formed on an extended line of a basin line partitioning the basin parts.

Piezo actuator and inkjet print head assembly having the same

Disclosed are an inkjet print head and a method of manufacturing the same. An inkjet print head according to an aspect of the invention may include: an inkjet board having an ink passage therein; a cutting portion provided outside the ink passage of the inkjet board and having a cutting surface created by separation into head chip units of the inkjet board; and an auxiliary cutting portion provided from one surface of the cutting portion inwardly in a thickness direction of the inkjet board, and assisting the separation into head chip units of the inkjet board.

Growing community of inventors

Suwon-si, South Korea

Jae Chang Lee