U.S. Philips Corporation

Oberthur Technologies

De La Rue Cartes Et Systemes

De La Rue Cartes Et Systemes Sas

Oberthur Card Systems Sas

Idemia France

Jacques Venambre

François Launay

Francois Launay

Yves Eray

Francedillaois Launay

Francois Bouchez

Pierre Loubly

Aurélie Barbotin

Yann Limelette

Henri Molko

Harry Van Noort

Jan Severin

Francoise Bouchez

François Bouchez

The invention concerns a smart card comprising a microcircuit, at least one other component including a protruding component and external contacts in a card-holder. The invention is characterized in that the microcircuit (), the protruding component () and the external contacts () form part of a subassembly (S) fixed in a housing (C+C+C) provided in part of the thickness of the card-holder, said subassembly including a support film () bearing on one inner surface the microcircuit () and at least the protruding component () and on one outer surface the external contacts (), a window () being arranged in said film opposite part of the projecting component.

Smart card comprising a protruding component and method for making same

A smart card comprises a magnetic antenna consisting of first () and second () coils. The card embossing area () is arranged outside of the first coil () and inside the second coil (). A smart card producing method is also disclosed.

Smart card producing method and a smart card in particular provided with a magnetic antenna

A method for production of a microcircuit card, includes the production of a card with electronic component connector pins for an electronic component within the thickness thereof and provided with a cavity with a base and defined by a slope on which the connector pins are arranged and production of a module including a support film with external contacts on an external face thereof and internal contacts on an internal face thereof. An anisotropic flexible conducting adhesive is then applied to the periphery of the internal face of the film, a resin more rigid than the adhesive is introduced into the cavity of the body, the module is inserted into the cavity such that the anisotropic adhesive is located opposite the periphery of the slope of the cavity, the anisotropic adhesive is thermally activated under pressure and the resin polymerized.

Method for production of a card with a double interface and microcircuit card obtained thus

To mount a microcircuit module in a cavity in a card forming a support, resin is deposited on the bottom of the cavity and the module is fitted in such a way that the microcircuit is coated with resin. A compressible annular area formed in the cavity completely surrounds the microcircuit and the coating material. The annular area extends over a continuous peripheral area of the bottom of the cavity.

Method for mounting a microcircuit in a cavity of a card forming a support and resulting card

A method of manufacturing a microcircuit board with a mechanical cut-out piece between the microcircuit and the board to limit stresses transmitted to the microcircuit. A blank of a network of conductors is created and the microcircuit is fixed in a container formed by shaping the blank, the microcircuit keeping the different parts of the network in position relative to each other and the module thus formed is installed in a cavity in the board by fixing the external connection areas onto the upper surface of the cavity.

Process for manufacture of a microcircuit board permitting limitation of the mechanical stresses transmitted to the microcircuit and board thus obtained

In a first step, electrical conductor tracks (15 to 20) are applied against the bottom and the walls of a cavity (5) for the integrated circuit (IC4) and connected to external contact pads (2) at the same side of the card. Said tracks lie alternately side-by-side at the bottom 7 of the cavity. In a second step, the IC (4) is glued with its surface which does not carry the contacts on said tracks on the bottom (7) of the cavity by means of a non-conducting glue. Then connections are realized by soldering of conductor wires (12) between contacts of the IC and ends of the tracks, and the cavity is filled with a protective resin. Application: Placement of an IC with inverted contacts in an electronic card support.

Method of manufacturing and assembling an integrated circuit card

The electronic card comprises an electrically insulating card support provided with a cavity for accommodating an integrated circuit and, on one surface, with metal contact pads which are electrically connected to contacts of the integrated circuit. The invention comprises the steps of: (i) the application by an MID technique (Moulded Interconnection Devices) of electrical conductor tracks, all arranged on the bottom and the lateral walls of the cavity, and each connected to one of the metal contact pads arranged on the surface of the support which comprises the cavity, (ii) the realization of electrical connections connecting the contacts of the integrated circuit arranged in the cavity to the conductor tracks on the bottom of the cavity, and (iii) filling up of the cavity with a protective resin which is subsequently polymerized.

Manufacturing method for an integrated circuit card

A chip card including a card base with a recess. A circuit support and a microcircuit is arranged on a circuit support surface which faces an interior of the recess and is spaced from the recess bottom. A raised portion is formed on the recess bottom and spaced from a cover section so as to divide the recess into two regions bounded by the recess bottom, the cover section and the raised portion. The first region is completely filled with an encapsulant and the second region is partly filled with the encapsulant.

Semiconductor chip card having selective encapsulation

A method of manufacturing a chip card comprising a card base in which a cover section is secured, which cover section comprises a circuit support and at least one microcircuit arranged on a lower surface of the circuit support, which lower surface faces the interior of a recess and is spaced from the inner surface of the bottom of the recess, in which method an encapsulant is applied to said inner surface. According to the invention the method comprises the following steps:

Method of manufacturing a chip card

The invention relates to a microcircuit card having a card support with a cavity in which a cover foil (200) is fixed, which foil (200) includes a circuit support (20) and at least one circuit (210) arranged on an inner surface of the circuit support (20) facing towards the interior of the cavity, the circuit (210) being arranged opposite a first portion of a bottom of the cavity. The circuit support (20) includes on its lower surface at least one energy transfer element (220) arranged opposite a second portion of the bottom of the cavity at a distance from the first portion.

Contactless microcircuit card

The invention relates to an integrated circuit card comprising a card support (130) which has a cavity (101) in which a vignette (200) is fixed, which vignette (200) comprises a circuit support (20, 40) and a circuit (10) arranged on a lower surface of the circuit support facing towards the interior of the cavity (101), the circuit (10) being positioned opposite a portion of a bottom (100) of the cavity (101). The bottom (100) has at least two weakenings (104) situated on either side of a bridge-portion (103) of the bottom.

Growing community of inventors

Ifs, France

Jacques Venambre