Northern Telecom Limited

Other

Jacques R St Louis

Geoffrey N Gale

Manfred Thumm

A suction cup for a contact lens holding device in which an inner curved surface of the cup has an outer continuous wall and a projection arrangement between the continuous and a centrally located aperture provided for air suction purposes. The projection arrangement is disposed to allow for air to be withdrawn through the aperture while providing a support for a lens as suction is applied. This cup, particularly for use with soft lenses, holds the lenses in position under suction without tending to draw the lenses at their centres into the aperture which would destroy suction. The projection arrangement may be a single wall. e.g. a spiral or a plurality of projections arranged in a particular manner for supporting the lens. The invention also includes a contact lens holding device having such a suction cup and a mouthpiece is preferably provided for the user to apply suction by insertion into his mouth.

Contact lens handling device

Mounting silicon devices on a ceramic substrate creates considerable problems when the device has a geometry, such as being very long relative to its width, due to flatness and thermal mismatches. In the present invention a thin silicon substrate is interposed between base and device, the substrate of a geometry which reduces flatness and thermal mismatching to acceptable levels. Also the use of a silicon substrate enables well developed and easily provided silicon technology to form conductor patterns for interconnecting between device and base, avoiding problems of producing such conductor patterns on the ceramic base. The invention is particularly useful for the mounting of linear devices, such as linear imagers, which can have a length to width ratio in excess of 20:1.

Method of mounting and packaging elongate silicon devices on a ceramic

In the packaging of devices, such as active and passive electronic devices, the devices can be selectively hermetically sealed or non-hermetically sealed, as desired, using to a large extent common apparatus. In the limit, only the fusion sealing for hermetic devices and plastic encapsulation for non-hermetic devices need be carried out on separate machines. This is obtained by use of a particular form of lead frame, common for both forms of devices, with common apparatus and steps prior to and following the sealing or encapsulation.

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Ottawa, Canada

Jacques R St Louis