Electroglas, Inc.

Xynetics, Inc.

Jacques L Roch

An apparatus for making drawings including a platen, an X-Y forcer slidably connected to the platen and a high speed holder adjustably connected to the forcer. The holder includes a plurality of separately actuatable mechanisms with each mechanism being connected to a tool for movement of the tool into or out of contact with a working surface. Means are included to precisely control each of the mechanisms in controlling the degree of contact which the tools make with the working surface. Also, means are included to precisely position each tool with respect to the mechanism which moves the tool into contact with the working surface. An apparatus for performing a working operation on a surface which apparatus includes a platen, an X-Y forcer slidably mounted thereon and a tool carried by the forcer for contact with the surface. Additionally, the apparatus includes means to vary the force applied by the tool against the working surface in response to the speed of movement of the tool with respect to the surface.

Universal high speed holder

A probe for testing an electrical circuit includes a dielectric support body and a pair of spring arms each having an inner end fixed to the support body and an outer end free to deflect with respect to the support body. Means for connecting the outer ends of the arms supports a probe tip having a point movable with the deflection of the arms into contact with a predetermined point on the electrical circuit to be tested. Means responsive to a signal provides for the deflection of the arms and the movement of the probe tip into contact with the chip. The arms have different lengths providing the probe tip with movement along a substantially straight line with respect to the plane of the electrical circuit.

Probe construction

Testing of integrated circuit components of the silicon wafer type for grading purposes is accomplished by supporting the wafer matrix on a platform type work table which is indexed in an x-y coordinate fashion, with the work table being moved vertically to a test position such that the test probes make contact with a precise predetermined position corresponding to the precise location of that portion of the integrated circuit to be tested. The work table is movable vertically with reference to a predetermined axis and rotatable with respect thereto such that the surface of the table remains perpendicular to the reference axis. The chuck assembly for moving the table includes a housing having a bore whose center forms the axis, with a chuck plate mounted for sliding movement in the bore. The end of the chuck plate is in the form of a flanged spool which receives bearing-eccentric assembly for effecting vertical movement while permitting rotation of the spool and the attached chuck plate. A multiphase stepping motor is used to drive the chuck plate through the bearing-eccentric assembly, the motor including optical limit switches sensing the motor shaft position and controlling the motor operation. The motor has a sinusoidal speed characteristic and uniformly decelerates as the table reaches the predetermined reference position. A vacuum assembly is used to provide a pressure differential across the table, the chuck assembly being electrically grounded to prevent interference with testing of wafers. Also described is an angular orientation system by which the rotation of the table may be controlled.

High speed precision chuck assembly

A tool for testing the miniaturized circuitry of silicone wafer devices. A ring-shaped structure is supported on a casting or platform for movement along X and Z axes in a horizontal plane. A probe is suspended from the ring-shaped element for contact with a lead-in point of the circuitry on the device to be tested. The probe may be moved along the X and Z horizontal axes and a Y vertical axis relative to the ring, movement in the X and Z axes being controlled by a single lever which acts between the ring and the probe. Movement of the probe in the Y axis is controlled by a screw-type pressure-exerting device which also serves as a pivot point for movement of the probe along the horizontal axes. A high performance board is supported on the ring to act as a junction board so that the probes may be connected to a cable which runs around the ring. The cable extends radially therefrom at a location such that it may be connected to suitable external control circuitry.

Microcircuit test device with multi-axes probe control

A probe for testing integrated circuit components which includes a dielectric support body, conductive arms supported by the body and with the arms including a longer arm and a shorter arm. The shorter arm is positioned above the longer arm in spaced relation thereto with each arm having an outer end connected to a conductive probe tip. The probe tip includes a downwardly positioned point for contact with a surface having an integrated circuit defined thereon and contact means are provided which cooperate with the arms and tip to transmit an electrical signal to the tip or receive a signal from the tip.

Micro-circuit test probe

An automatic cable forming system incorporating an X-Y positioner for automatically laying a plurality of individual wires in a predetermined pattern to form a complex cable and including an array of individual spools each including a tensioning device to produce a predetermined tension on a wire as it is unspooled and to take up any slack in the wire. The system also includes a plurality of individual capstan pulleys each receiving an individual wire from one of the spools and with a single capstan drive for engaging one capstan pulley at a time for individually feeding the plurality of wires from the spools. The wires pass to a plurality of individual clamps for clamping the plurality of individual wires except the wire fed from the capstan pulley engaged by the capstan drive, and with a wire feed mechanism intermediate the capstan drive and the clamps for feeding the wires to a single wire head. The head is coupled to the X-Y positioner for receiving the wire fed from the capstan pulley engaged by the capstan drive for laying the wire in a predetermined pattern and with a single wire head individually receiving each one of the plurality of wires as each wire is fed from its capstan pulley for laying the plurality of wires in the predetermined pattern to form the complex cable. The wire head includes a roller to engage the wire feed mechanism to feed the wire through the wire head to have its end clamped by end clamps before laying the wire. The wire head also includes an internal clamp, a cutter and a wire presence sensor. The wire head also has a feed tube mounted on a rocker assembly.

Automatic cable forming system

A probe for testing integrated circuit components which includes a dielectric support body, conductive arms supported by the body and with the arms including a longer arm and a shorter arm. The shorter arm is positioned above the longer arm in spaced relation thereto with each arm having an outer end connected to a conductive probe tip. The probe tip includes a downwardly positioned point for contact with a surface having an integrated circuit defined thereon and contact means are provided which cooperate with the arms and tip to transmit an electrical signal to the tip or receive a signal from the tip. The probe tip includes a thin-walled bent tube that is secured to the probe. The bend in the thin-walled tube serves to frictionally hold a needle in the thin-walled tube because on insertion of a needle the tube will be resiliently straightened to create a frictional force between the tube and the needle.

Testing of integrated circuit components of the silicon wafer type is accomplished by a test probe assembly mounted on a support table, the latter being spaced vertically with respect to a platform on which the circuit components are placed. The test probe assembly, which includes a probe test unit, is mounted on the support in such a fashion that the test probe may be moved to a precise predetermined position corresponding to the precise location of that portion of the integrated circuit to be tested. This is accomplished by mounting the assembly housing such that it moves arcuately with respect to its support structure, while providing a slide unit within the housing which is movable vertically as well as axially with respect to the housing. Once the proper predetermined position has been determined and the test probe assembly adjusted such that the probe is properly aligned with the particular portion of the integrated circuit to be tested, the entire assembly is maintained in proper position. Thereafter, by computer control, the platform supporting the integrated circuits to be tested is indexed in accordance with the predetermined program and each of the particular circuits of the integrated circuit units is tested in the desired sequence. The test probe assembly housing includes separate rotatable adjusting members which independently bring about axial and vertical movement of the slide member upon which the test probe is mounted. The probe test unit, supported by the slide, is connected by means of a cable to a suitable external control circuit for testing the individual circuits on the integrated circuit wafer. Also described is an improved probe arm assembly having a needle tip which operates to reduce the capacitive effect between closely spaced probe arms.

Growing community of inventors

San Jose, CA, United States of America

Jacques L Roch