Thomson-csf

Jacques Espaignol

Gerard Cachier

Edmond Klein

A batch production process for millimeter wave sources of a module type. This module type consists of a basic metallic support, bearing a diode under the form of a semiconductor chip soldered on a projection of the support, the diode being surrounded by a dielectric substance forming a medium extending up to half a wavelength on the same support, with a metallization covering the surrounding medium and connected with the top of the chip by a metallic block. In a first embodiment, the batch process is limited to the central part of the module i.e. the semiconductor chip, the block and only a part of the dielectric medium, as well as a part of the metallic support. In a second embodiment of the process, the collective production of the entire module is achieved.

Process for the manufacture of millimeter wave sources of the module type

A source of millimeter waves adjustable in power and frequency and embodied as a cylindrical waveguide one end of which is provided with a movable piston and the other end with a directive antenna generally a radiating horn. Between the ends is tapped a cylindrical waveguide branch in which slides a sub-assembly carrying a radiating module containing an oscillating diode. The position of the module affects the power and the frequency of oscillation of the source and the position of the movable piston acts on the power emitted by the radiating horn.

Solid-state millimeter wave source comprising a directive antenna

A unitary device comprising a millimeter wave source embedded in a block which integrated simultaneously the bias means, the heat-dissipation means and the impedance-matching arrangements. The source, which is an avalanche diode of very small dimensions, is welded to a dissipating mounting comprising a central platform with a slight central projection. Subsequently, the diode is surrounded by a glass ring whose central opening is filled with polymerizable resin. Mechanical grinding is carried out in order to bare the top layer of the diode and metallizing performed in order to provide a supply terminal for DC. In an application of the invention to a millimeter waveguide, the supply contact is formed by a simple transverse metal wire leaving the walls of the waveguide through insulating lead-throughs.

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Paris, France

Jacques Espaignol