Matra Marconi Space France

Matra

Jacques De Givry

Jean P Lalfer

Jean C Vallet

Jean-Claude Vallet

The chip is fixed to a substrate by its lower face. At least one wire-bonding adaptor in the form of a board is used, the upper face of which has first bonding pads along at least one first edge and second bonding pads along at least one second edge, and including electrical connections between the first and second bonding pads. The wire-bonding adaptor is adhesively bonded by its lower face to the upper face of the chip so that the said first edge is adjacent to a row of output pads located elsewhere than on the periphery of the upper face of the chip and so that the said second edge is adjacent to the periphery of the chip. Bonding wires are bonded, on the one hand, between the output pads of the said row and the first bonding pads and, on the other hand, between the second bonding pads and conducting pads on the substrate.

Method of connecting the output pads on an integrated circuit chip, and

The multi-chip module comprises a co-fired substrate, and, on at least ont face of the substrate, a set of superimposed ceramic insulating layers, fired at a temperature substantially smaller than the firing temperature of the substrate. Conducting interconnection lines are formed in thick layers deposited between said ceramic insulating layers. Electronic components are mounted at the surface of the set of ceramic layers.

Method for connecting electronic circuits in a multi-chip module having

A pluggable electrical connection device comprises at least one pin-shaped male element of electrically conductive material and at least one female element. The female element is a metal coil spring having at least four turns sufficiently spaced apart to receive the male element between two mutually adjacent turns. The coil spring may have end portions which are bent to constitute tabs parallel to an axis of said coil spring and soldered to said support. It may also be locked between two elongated holes formed in two opposed sides of a cage and connected to a base circuit fast with said cage by pin.

Pluggable electrical connection device

A memory component has a rectangular semiconductor substrate containing active memory circuits and output terminals on a major surface thereof. An insulating layer on the major surface receives a plurality of metal connection leads, connecting the output terminals to connection pads located on the major surface along only one of longer sides of the substrate. A plurality of additional pads are distributed between the connecting pads and are devoid of connection leads. A memory module comprising several stacked memory components is also described, which uses the additional pads as relays.

Semiconductor memory component comprising stacked memory modules

A memory module has, on an interconnection substrate, a plurality of semi-conductor memory chips each having the same elongated shape and having output connections located at the end thereof. It has at least two chips which are mutually stacked and which are crossed so that the outputs of one chip are available beyond the periphery of the chip which is located under it in the stack. Consequently, the outputs of each chip may easily be connected to the substrate by bonded flexible wires.

Solid state memory modules and memory devices including such modules

For flat mounting of electronic microcomponents, such as chip carriers, on a printed circuit support, the electrical contacts of the microcomponent are connected to pads on the printed circuit, microcomponents having solderable contacts on a lower face thereof, comprising electrically connecting said solderable contacts of the microcomponent to respective pads on the printed circuit through sections of flexible wires having a sufficient degree of curvature for mechanically uncoupling said microcomponents from said printed circuit support and mechanically connecting the microcomponent to the support through a spacer having planar dimensions lower than planar dimensions of a base of said microcomponent for providing access to said contacts for connecting said sections thereto. An intermediate product includes the chip carrier and a grid conencted to the lower face thereof, including connecting sections and an edge strip connecting the external ends of all sections.

Mounting of electronic microcomponents on a support

For locally stripping an electric wire, the wire is maintained in a guide, the insulating material is cut with rotary knives over a fraction only of its thickness and the residual insulation material is broken by pulling after the knives have been stopped. An apparatus for carrying out the process has a stripping head supporting a wire-guide, provided with a drive motor for rotation about the axis of the guide and carrying knives radially movable between an inner and an outer position. An electromagnetically controlled wire-clamping system is used for axially moving the wire.

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Les Loges En Josas, France

Jacques De Givry