Other

Shipley Company LLC

Geo-centers, Inc.

USA As Represented by Secretary of the Navy

Intel Corporation

The Government of the United States of America, As Represented by the

Geo-center, Inc.

Jacque H Georger, Jr

Jeffrey M Calvert

Joel M Schnur

Paul E Schoen

Martin C Peckerar

Ronald R Price

Xing Su

Paul Yager

Walter J Dressick

David A Stenger

Lei B Sun

Alan S Rudolph

Robert F Brady, Jr

Christie R Marrian

Gary S Calabrese

Mu-San Chen

Thomas L Fare

Charles S Dulcey

Mary A Testoff

John F Bohland

Milton L Rebbert

James J Hickman

George G Barclay

Roger F Sinta

Alok Singh

Mark D Denison

Sheri L Ablaza

Apparatus and methods are disclosed for electrically active combinatorial-chemical (EACC) chips for biochemical analyte detection. An apparatus includes a substrate that has an array of regions defining multiple cells, wherein each of the cells includes a reaction cavity that contains multiple functional binding groups. A method of detecting an analyte providing the reaction cavity between a source and a drain or a pair of electrodes, applying a voltage and monitoring a parameter indicative of an analyte characteristic. A process of fabricating an EACC include bonding an analyte to the multiple functional binding groups of each reaction cavity, and forming an analyte sensing structure including the substrate.

Electrically active combinatorial chemical (EACC) chip for biochemical analyte detection

Tubules which contain an active agent in their lumen and compositions containing such microtubules are effective for providing a slow, controlled release of the active agent. Such microtubules are useful in the production of coating compositions for the protection of surfaces coming into contact with water, adhesive resins for the production of laminated wood products, and devices for dispensing pesticides.

Method of controlled release and controlled release microstructures

The invention provides inter alia new methods to produce aqueous developable resin binders for negative-acting photoresists. The methods in general comprise free radical polymerization of one or more types of monomers in the presence of a free radical polymerization control agent, particularly a nitroxide polymerization control agent such as a piperidinyloxy (N-oxy) free radical, and wherein at least one of the monomer types contains a moiety that enables aqueous solution development of a photoresist composition containing the formed polymer.

Narrow molecular weight distribution polymers and use of same as resin

The invention provides novel polymers and photoresist compositions that comprise a photoactive component and use such polymers as a resin binder component. The polymers of the invention in general comprise at least one repeating unit that includes a moiety that has a high carbon content, and preferably is an aromatic group. Preferred polymers of the invention comprise at least one repeating unit that includes a moiety that is an extended aromatic ring, or polycyclic aromatic ring system containing 2 or more rings, preferably at least two of the rings being fused, and from about 3 to 8 ring members in each ring. Photoresists of the invention include both positive-acting and negative-acting compositions and contain a resin binder component that comprises the described polymer.

Polymers and photoresist compositions comprising same

High aspect ratio metal microstructures may be prepared by a method involving

High aspect ratio metal microstructures and method for preparing the same

Patterned surfaces for the selective adhesion and outgrowth of cells are useful in cell culture devices, prosthetic implants, and cell-based microsensors. Such surfaces may be prepared by a deep ultraviolet photolithographic technique.

Deep ultraviolet photolithographically defined ultra-thin films for

The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.

Selective metallization process

Controlled release microstructures

A process for producing metal plated paths on a solid substrate of the kind which has polar functional groups at its surface, utilizing a self-assembling film that is chemically absorbed on the substrate's surface. The solid substrate may, for example, be an insulator of the kind used for substrates in printed circuitry or may, as another example, be a semiconductor of the kind used in semiconductor microcircuitry. The chemical reactivity in regions of the ultra-thin film is altered to produce a desired pattern in the film. A catalytic precursor which adheres only to those regions of the film having enough reactivity to bind the catalyst is applied to the film's surface. The catalyst coated structure is then immersed in an electroless plating bath where metal plates onto the regions activated by the catalyst.

High resolution patterning on solid substrates

A process for producing metal plated paths on a solid substrate of the kind which has polar functional groups at its surface utilizes a self-assembling monomolecular film that is chemically adsorbed on the substrate's surface. The solid substrate may, for example, be an insulator of the kind used for substrates in printed circuitry or may, as another example, be a semiconductor of the kind used in semiconductor microcircuitry. The chemical reactivity in regions of the ultra-thin film is altered to produce a desired pattern in the film. A catalytic precursor which adheres only to those regions of the film having enough reactivity to bind the catalyst is applied to the film's surface. The catalyst coated structure is then immersed in an electrolers plating bath where metal plates onto the regions activated by the catalyst.

High resolution metal patterning of ultra-thin films on solid substrates

Tubular, spheroidal, and helical lipid microstructures are individually clad with a metal coat deposited on the microstructures by an electroless plating bath. In metal cladding the microstructures, the surfaces of the lipid microstructures are sensitized by adsorption thereon of a catalytic precursor which enables metal from the electroless plating bath to deposit upon and adhere to the sensitized surface. The metal plate is electrically conductive and may also be magnetic. A composite material is produced by embedding the metal clad microstructures in a matrix of a polymer such as an epoxy or a polyurethane.

Metal clad lipid microstructures

Growing community of inventors

Springfield, VA, United States of America

Jacque H Georger, Jr