International Business Machines Corporation

Advanced Micro Devices Corporation

Globalfoundries Inc.

King Abdulaziz City for Science and Technology

Jacquana T Diep

Young-Hye Na

Ankit Vora

Mohammad A Khan

Seah Sun Too

Ratnam Sooriyakumaran

Raj N Master

Geraud J Dubois

Blake W Davis

Radwan A Alrasheed

Majed S Nassar

James L Hayward

A thin film composite membrane includes an active layer on a support membrane, wherein the active layer includes at least two chemically distinct first and second crosslinked polyamide film sub-layers. The first film sub-layer includes a polyamide unit; and the second film sub-layer includes a copolyamide with two chemically distinct polyamide units. The first film sub-layer is closer to the support than is the second film sub-layer.

Composite membrane with multi-layered active layer

A polymeric membrane on a support, wherein the polymeric membrane includes a crosslinked polymer covalently bound to a molecular cage compound. An interfacial polymerization method for making the polymeric membrane is also disclosed.

Thin film composite membranes embedded with molecular cage compounds

A method of photo-grafting onto a separation membrane a copolymer includes at least one of: and; For example, in Structure 1A, x&#x2267;2 and y&#x2267;1; Rand Rare independently selected from the group consisting of CHand H; Ris independently selected from the group consisting of poly(oxyalkylene), quaternary ammonium salts, pyridinium salts, sulfonium salts, sulfobetaines, carboxybetaines, alcohols, phenols, tertiary amines, aryl groups; linear, branched and cyclic alkylenes; linear, branched and cyclic heteroalkylenes; linear, branched and cyclic fluoroalkylenes; and siloxyl; Ris independently selected from the group consisting of linear, branched, and cyclic alkylenes; linear, branched and cyclic hetroalkylenes; linear, branched and cyclic fluoroalkylenes; phenyl; and siloxyl; and Zis 0 or 1.

Filtration membrane with covalently grafted fouling-resistant polymer

Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.

Integrated circuit socket

Various integrated circuit packages, lids therefor and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing an integrated circuit package lid that has a surface adapted to face towards an integrated circuit, and forming a wetting film on the surface. The wetting film has at least one void where the surface of the lid is exposed. The void inhibits bonding so that a stress reduction site is produced.

Integrated circuit package lid with a wetting film

Various method and apparatus for packaging an integrated circuit are provided. In one aspect, a method of packaging an integrated circuit is provided that includes coupling an integrated circuit to a substrate, mixing an adhesive with a plurality of particles, and coupling a lid to the substrate with the adhesive. At least a portion of the plurality of particles in the adhesive oppose compressive force from the lid to restrict rotation of the lid relative to the substrate.

Reduction of damage to thermal interface material due to asymmetrical load

Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another aspect, an integrated circuit package device is provided that includes a lid that has a surface for applying pressure to an integrated circuit when the lid is in a selected position. A gold film is coupled to the surface. The gold film has a periphery and a plurality of rounds extending from the periphery.

Growing community of inventors

San Jose, CA, United States of America

Jacquana T Diep