Sulzer Metco (us) Inc.

Oerlikon Metco (us) Inc.

University of Alberta

Jacobus C Doesburg

Mitchell R Dorfman

Liangde Xie

Richard Karl Schmid

Matthew Gold

Douglas Gordon Ivey

Barbara M Djurfors

A high purity yttria or ytterbia stabilized zirconia powder wherein a purity of the zirconia is at least 99.5 weight percent purity and with a maximum amount of specified oxide impurities.

Ceramic material for high temperature service

Thermal barrier coating made from a thermally sprayable powder that includes yttria stabilized zirconia and hafnia, from 6 to 9 weight percent yttria, and total impurities less than or equal to about 0.1 weight percent. The thermal barrier coating has from about 5 to 250 vertical macro cracks per 25.4 mm length measured along a coating surface and the macro cracks are oriented perpendicular to a surface of a substrate containing said coating.

The present invention provides a high-purity fused and crushed stabilized zirconia powder. The powder&#x2014;with or without further processing, such as plasma spheroidization&#x2014;is used in thermal spray applications of thermal barrier coatings (TBCs) and high-temperature abradables. The resulting coatings have a significantly improved high temperature sintering resistance, which will enhance the durability and thermal insulation effect of the coating.

High-purity fused and crushed zirconia alloy powder and method of producing same

A solder composition for forming a solder joint. The composition includes a powder material including a solid metal matrix material and a filler material. The solid metal matrix material includes one or more of tin-silver-copper (Sn&#x2014;Ag&#x2014;Cu), tin-copper (Sn&#x2014;Cu), tin-copper-nickel (Sn&#x2014;Cu&#x2014;Ni), tin-silver (Sn&#x2014;Ag), tin-silver-bismuth (Sn&#x2014;Ag&#x2014;Bi), tin-bismuth-indium (Sn&#x2014;Bi&#x2014;In), tin-gold (Au&#x2014;Sn), tin-zinc (Sn&#x2014;Zn), tin-zinc-bismuth (Sn&#x2014;Zn&#x2014;Bi), tin-bismuth-silver (Sn&#x2014;Bi&#x2014;Ag), tin (Sn), tin-indium (Sn&#x2014;In), indium (In), indium-silver (In&#x2014;Ag), and tin-lead (Sn&#x2014;Pb). The filler material includes one or more of copper (Cu), gold (Au), nickel (Ni), nickel-gold (Ni&#x2014;Au), carbon, silver (Ag), aluminum (Al), molybdenum (Mo), nickel (Ni) or nickel-gold (Ni&#x2014;Au) coated carbon, the platinum group metals (PGM's), and their alloys.

Material and method of manufacturing of a solder joint with high thermal conductivity and high electrical conductivity

The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent solderability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.

Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity

An electrodeposition process for producing a layered composite material and the layered composite material produced by the process. The layered composite material includes at least one layer of a first alloy species of an alloy and at least one layer of a second alloy species of the alloy. The first alloy species and the second alloy species have distinguishable properties. The process includes the steps of first energizing an electroplating circuit to provide a first electroplating current to deposit a layer of the first alloy species and second energizing the electroplating circuit to provide a second electroplating current to deposit a layer of the second alloy species. The alloy is preferably a gold-tin alloy, the first alloy species is preferably the Au Sn alloy phase and the second alloy species is preferably the AuSn alloy phase.

Growing community of inventors

Brooklyn, NY, United States of America

Jacobus C Doesburg