Tyco Submarine Systems Ltd.

Interplex Qlp, Inc.

Jacob Shverdin

Michael A Zimmerman

Holt A Murray, Jr

Keith Smith

William Scott Loewenthal

A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.

Plastic electronic component package

In accordance with the present invention, an apparatus and method for application of a chemical process on a component surface is provided. In an embodiment for an apparatus for preparing a component surface for application of a chemical process, the apparatus includes a base, an o-ring retainer, an o-ring, a boot, and a retention ring. The component is mounted on the base. The o-ring is positioned on the o-ring retainer and the o-ring retainer is inserted through an aperture in the component and mated with the base. The assembled component, base, o-ring retainer, and o-ring are positioned within the boot. The retention ring is positioned around the boot. In an embodiment for a method for applying a wet chemical solution to the component surface to oxidize the component surface, where the wet chemical solution is contained within a tank, the method steps include immersing the component in the wet chemical solution, heating the wet chemical solution with a heater, and positioning the surface of the component in a horizontal, upward facing position and within the tank such that a baffle is disposed between the surface and the heater.

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Swampscott, MA, United States of America

Jacob Shverdin