Watlow Electric Manufacturing Company

Jacob Robert Lindley

Philip Steven Schmidt

Louis P Steinhauser

Cal Thomas Swanson

Sanhong Zhang

Mohammad Nosrati

Kevin Ptasienski

Dennis Stanley Grimard

Kevin Smith

Allen Norman Boldt

Mark Denis Everly

Miranda Pizzella

Dean J Meyer

Alexander D Glew

George F Jambor

Jeremy J Quandt

Ray Alan Derler

Kevin Robert Smith

Magdi K Khair

Eric Ellis

Scott H Boehmer

Dennis P Long

John Bergen

John Lilleland

Troy Ruben Bolton

Daniel Gander

Keith Ness

Fatemeh Nosrati

John Paskvan

Hanwen Yuan

Andrew Oplawski

Michael A Jones

A termination assembly for a heater assembly includes a plurality of resistive heaters arranged in discrete power phases, each resistive heater comprising a resistive heating element surrounded by dielectric material and a sheath. The termination assembly includes a plurality of electrically nonconductive members. Each electrically nonconductive member includes a plurality of apertures configured to receive power pins of the plurality of resistive heaters. The termination assembly includes a plurality of connectors configured to connect the power pins to the electrically nonconductive members. Each electrically nonconductive member includes a number of the plurality of connectors corresponding to a number of power pins being terminated. The termination assembly includes an electrical circuit embedded in or disposed on at least one of the plurality of electrically nonconductive members.

Encapsulated bus circuit for fluid heating systems

A method for monitoring a surface condition of a component includes providing thermal energy to a component, determining a thermal response of the heater in response to providing the thermal energy, and determining a thermal characteristic of the component based on a reference thermal response and the thermal response. The method includes predicting the surface condition of the component based on the thermal characteristic and a predictive analytic model, where the predictive analytic model correlates the thermal characteristic of the component to an estimated surface condition of the component.

Method of monitoring a surface condition of a component

A method of controlling a thermal system of an industrial process includes monitoring intermediate data, associating the intermediate data with correlation data, wherein the correlation data includes an internal process control input, an external heater control input, the output control, or a combination thereof. The method further includes generating a model that defines a relationship between the intermediate data and the correlation data, identifying a state of the heater system based on the model, and selectively performing a corrective action based on the identified state of the heater system.

Systems and methods for using intermediate data to improve system control and diagnostics

A method for controlling a heated process of an electric heater includes obtaining a setpoint variable indicating a target temperature of the heater. The method includes identifying an energy profile for the heater based on the setpoint variable. The energy profile provides a defined magnitude of initial electrical energy to be applied to the heater to have a temperature of the heated process reach the target temperature. The method includes obtaining a process variable indicating a performance characteristic of the heated process. The method includes providing electrical energy to the heater based on at least one of the energy profile and the process variable.

Method and system for controlling an electric heater using control on energy

A method of monitoring a condition of a dynamic system includes installing a vibration signal acquisition device at a predetermined location of the dynamic system, acquiring vibration signals by the vibration signal acquisition device, analyzing the vibration signals in a frequency domain, and predicting a change in the condition of the dynamic system based on the vibration signals in the frequency domain. A system is also provided, and a condition of the dynamic system includes clogging.

System and method for predicting and controlling gas line performance

A method includes providing thermal energy to a component, determining a thermal response of the component in response to providing the thermal energy, and determining a thermal characteristic of the component based on a reference thermal response and the thermal response. The method includes predicting a surface condition of the component based on the thermal characteristic and a predictive analytic model, where the predictive analytic model correlates the thermal characteristic of the component to an estimated surface condition of the component.

A thermal system includes a base member, a two-phase fluid, a tuning heater, and a chuck. The base member includes at least one fluid passageway. The two-phase fluid is disposed within the fluid passageway. A pressure of the two-phase fluid is controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. The tuning heater is secured to the base member. The chuck is secured to the tuning heater opposite to the base member. The tuning heater includes a plurality of zones to fine tune a heat distribution provided by the base member to the chuck.

High definition heater system having a fluid medium

A fluid control system is provided that in one form includes a first flow channel, a second flow channel, a heater disposed in the second flow channel, and a fluid control device disposed upstream from the first and second flow channels. When the heater is turned on, the fluid control device changes a fluid flow rate through at least one of the first flow channel and the second flow channel. In another form, the fluid control system includes a bypass conduit, a heater disposed within the bypass conduit, and a fluid control device disposed near the inlet and outlet of the bypass conduit. In still another form, the fluid control system includes a regeneration device disposed downstream from at least one exhaust aftertreatment system and closes an outlet of the exhaust pipe.

Heater-actuated flow bypass

An exhaust system is provided that includes an exhaust aftertreatment unit, first and second exhaust pathway in communication with and upstream of the exhaust aftertreatment unit, a thermally activated flow control device operable in a first and second mode, and a thermal storage device. In the first mode, the flow control device permits exhaust to flow to the aftertreatment unit through the first pathway and inhibits flow through the second pathway. In the second mode, the flow control device permits exhaust flow to the aftertreatment unit through the second pathway and inhibits flow through the first pathway. The flow control device may switch between the first and second modes based on a change of temperature. The thermal storage device is within the second pathway, stores thermal mass, and provides thermal insulation to enable a catalyst of the aftertreatment unit to maintain a predetermined temperature for a predetermined time.

Exhaust system with actuated flow bypass and thermal storage device

A heater system is provided that includes a base functional layer having at least one functional zone. A substrate is secured to the functional member, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer provides lower power than the base functional layer. A component is secured to the tuning layer opposite the substrate, and the substrate defines a thermal conductivity to absorb and dissipate a requisite amount of power from the base functional layer. A control system is also provided that has a plurality of addressable control elements in electrical communication with power lines and with the tuning layer, the control elements providing selective control of the tuning layer zones.

High definition heater and method of operation

A method of forming a heater assembly for use in semiconductor processing includes thermally securing a heater substrate to an application substrate; and applying a layered heater having at least one functional layer to the heater substrate after the heater substrate is secured to the application substrate. The heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of the functional layer. The material of the functional layer is not capable of withstanding the elevated temperature of the thermal securing step.

Method of forming a composite substrate for layered heaters

A heater assembly for use in semiconductor processing that includes an application substrate; a heater substrate secured to the application substrate by a thermal bonding process; and a functional layer disposed onto the heater substrate by a layered process. In this heater assembly, the heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of the functional layer.

Composite substrate for layered heaters

A thermal system includes: a base member including at least one fluid passageway in which a two-phase fluid is disposed; a tuning layer secured to the base member; and a control system. The pressure of the two-phase fluid is controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. The tuning layer includes a plurality of zones. The control system includes a plurality of sets of power lines in communication with the tuning layer, and a plurality of addressable control elements in electrical communication with the power lines and with the tuning layer. The control elements provide selective control of the tuning layer zones.

The present disclosure provides a thermal system that includes an array of heating resistor circuits having first termination ends and second termination ends, and a plurality of nodes connected to the heating resistor circuits at the first and second termination ends. The thermal system further includes power wires to provide power to the heating resistor circuits and signal wires to sense a temperature of each of the heating resistor circuits. Each node is connected to a power wire and to a signal wire, and a number of heating resistor circuits is greater than or equal to a number of power wires and to a number of the signal wires.

Integrated heater and sensor system

An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment, that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.

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St. Louis, MO, United States of America

Jacob Robert Lindley