Applied Materials, Inc.

Applied Material, Inc.

Jacob Newman

Andrew J Constant

Shay Assaf

William Tyler Weaver

Jeffrey C Hudgens

Dinesh Kanawade

Stephen Hickerson

Michael Robert Rice

Jason M Schaller

Paul Benjamin Reuter

Nir Merry

Robert Brent Vopat

Sushant Suresh Koshti

Wei Liu

Christopher Sean Olsen

Charles T Carlson

Johanes F Swenberg

Shiyu Sun

Alexander Berger

Jing Tang

Tze Wing Poon

Marvin L Freeman

Malcolm N Daniel, Jr

Udayan Ganguly

Sunderraj Thirupapuliyur

Ulrich Oldendorf

Martin Aenis

Vicky U Nguyen

Steven Verhaverbeke

Daniel John Hoffman

Stephen Moffatt

Kallol Bera

Majeed Foad

Todd J Egan

Benjamin B Riordon

Ananthkrishna Jupudi

Swaminathan T Srinivasan

Yuichi Wada

Yueh Sheng Ow

Yoshitaka Yokota

Douglas H Burns

Kim Ramkumar Vellore

Douglas Brian Baumgarten

Jeffrey Charles Blahnik

Devendra Channappa Holeyannavar

Jose Antonio Marin

Preetham P Rao

Vinodh Ramachandran

Miriam Schwartz

Arunkumar Ramachandraiah

Ami Sade

Narayanan Ramachandran

David Phillips

Srinivas Poshatrahalli Gopalakrishna

Swaminathar Srinivasan

Michael Thomas Haag

Yoshita Yokota

Devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a load lock disposed within the interior volume of the factory interface, and a factory interface robot disposed within the interior volume of the factory interface, wherein the factory interface robot is configured to transfer substrates between a set of substrate carriers and the load lock.

Systems and methods for integrating load locks into a factory interface footprint space

A factory interface for an electronic device manufacturing system can include a load lock disposed within the interior volume of a factory interface and a factory interface robot disposed within the interior volume of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can comprise a vertical tower, a plurality of links, and an end effector.

Factory interface robots usable with integrated load locks

An embodiment is a processing system for processing a substrate. The processing system includes a Front Opening Unified Pod (FOUP) load lock (FLL) and a vacuum system. The FLL has walls defining an interior space therein. The FLL includes load lock isolation and tunnel isolation doors. The load lock isolation door is operable to close a first opening in a first sidewall of the FLL. The first opening is sized so that a FOUP is capable of passing therethrough. The tunnel isolation door is operable to close a second opening in a second sidewall of the FLL. The second opening is sized so that a substrate is capable of passing therethrough. The vacuum system is fluidly connected to the interior space of the FLL and is operable to pump down a pressure of the interior space of the FLL.

Processing system having a front opening unified pod (FOUP) load lock

Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

Transport system

Embodiments of the disclosure are directed to load lock chambers and methods of using load lock chambers. The load lock chambers include a middle section, an upper section connected to the middle section and a lower section connected to the middle section. A slit valve in a facet on the outside of the middle section provides an opening to access the middle volume from outside the load lock.

Multi-wafer volume single transfer chamber facet

The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a first load lock disposed within the interior volume of the factory interface, and a first factory interface robot disposed within the interior volume of the factory interface, wherein the first factory interface robot is configured to transfer substrates between a first set of substrate carriers and the first load lock.

Systems for integrating load locks into a factory interface footprint space

Full wafer in-situ metrology chambers and methods of use are described. The metrology chambers include a substrate support and a sensor bar that are rotatable relative to each other. The sensor bar includes a plurality of sensors at different radii from a central axis.

In-situ full wafer metrology system

Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.

Ambient controlled transfer module and process system

An apparatus for relaying microwave field intensity in a microwave cavity. In some embodiments, the apparatus comprises a microwave transparent substrate with at least one Radio Frequency (RF) detector that is capable of detecting a microwave field and generating a signal associated with a field intensity of the detected microwave field and a transmitter that receives the signal associated with the detected microwave field from the RF detector and transmits or stores information about the detected microwave field intensity. In some embodiments, the apparatus relays the microwave intensity via a wired, wireless, or optical transmitter located in proximity of the RF detector.

Methods and apparatus for detecting microwave fields in a cavity

Electronic device processing systems may include a mainframe housing having a transfer chamber, a first carousel assembly, a second carousel assembly, a first load lock, a second load lock, and a robot adapted to operate in the transfer chamber to exchange substrates between the first and second carousels and the first and second load locks. The robot may include first and second end effectors operable to extend and/or retract simultaneously or sequentially along substantially co-parallel lines of action. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.

Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing

Embodiments described herein relate to apparatus and methods for thermally processing substrates. In one embodiment, a processing system includes a factory interface coupled to a plurality of load lock chambers. The plurality of load lock chambers are coupled to a transfer chamber which houses a robot. A thermal processing chamber is coupled to the transfer chamber and the robot is configured to transfer substrate between the load lock chambers and the thermal processing chamber. A multi-substrate support, which is disposed within the thermal processing chamber, rotates to facilitate efficient substrate thermal processing. A gas curtain apparatus disposed in a port plenum provides environment separation between the processing chamber and the transfer chamber while enabling efficient substrate transfer between the thermal processing chamber and the transfer chamber.

High productivity soak anneal system

Embodiments relate to methods and apparatus for batch processing of substrates during epitaxial film formation. In one example, a process chamber includes a chamber lid and substrate support. The chamber lid includes a centrally disposed gas inlet and a first gas deflector coupled to the chamber lid and adapted to direct the first process gas laterally across surfaces of a plurality of substrates. The lid also includes one or more gas outlets disposed radially outward of the centrally disposed gas inlet, and a plurality of lamps disposed between the centrally disposed gas inlet and the one or more gas outlets. The substrate support is rotatable and includes both a gas passage formed therein for introducing a second process gas to the internal volume of the process chamber and a second gas deflector adapted to direct the second process gas laterally across the surfaces of the plurality of substrates.

Batch epitaxy processing system having gas deflectors

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Palo Alto, CA, United States of America

Jacob Newman