Delaware Capital Formation, Inc.

Vectron, Inc.

Jacob M Li

Roger L Clark

Samuel Shniper

Joseph V Adler

Otmar Boser

Roger J Clark

David Lane

The present invention is for a thermally controlled package for oscillators, particularly evacuated miniature surface acoustical wave oscillators (EMSO) devices. In a preferred embodiment the surface acoustical wave device is bonded directly to a heated substrate. The package is evacuated to improve temperature characteristics. A temperature heater, sensor, and control controller are utilized to maintain the internal package temperature above ambient. In one embodiment there is an additional substrate layer that house components that are not sensitive to temperature with interconnects electrically connecting the heated substrate and the additional substrates.

Evacuated hybrid ovenized oscillator

A crystal resonator assembly is described wherein a piezo-electric resonator is mounted over a heat conducting substrate and one or more heat generating elements are located on the substrate. The heating elements provide heat both by conduction and radiation and by virtue of the use of a heat conducting substrate enable a uniform and efficient heating of the crystal resonator to a desired oven temperature.

Oven-heated crystal resonator and oscillator assembly

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Danbury, CT, United States of America

Jacob M Li