Broadcom Corporation

Avago Technologies General IP (singapore) Pte. Ltd.

Jacob Jude Rael

Ahmadreza Rofougaran

Maryam Rofougaran

Brima Babatunde Ibrahim

Stephen Wu

Meng-An Pan

Hung-Ming Chien

Shahla Khorram

Shervin Moloudi

William T Colleran

Masood Syed

Hooman Darabi

Syed Masood

Arya Behzad

Chryssoula Kyriazidou

Harry Contopanagos

Ed Chien

Tirdad Sowlati

Ali Afsahi

Rohit Gaikwad

Andrew Robert Adams

Dandan Li

Henry Chen

Matthew Vernon Kaufmann

Keith Andrews Carter

Malcolm MacIntosh

Jianping Peng

A wireless communication device includes a first circuit including a baseband circuit and a radio circuit, and at least one frontend module (FEM) remote from the first circuit and placed in close proximity to and coupled to at least one radio-frequency (RF) antenna. The FEM is coupled to the first circuit via interface circuitry. An FEM comprises a frontend (FE) circuit including one or more low-noise amplifiers (LNAs), one or more power amplifiers (PAs), and at least one of a multi-pole switch and a multiplexer. The multi-pole switch and the multiplexer being implemented on a first side of the FEM coupled to the interface circuitry. The interface circuitry includes at least some of filters, splitters, multi-pole switches, and multiplexers to reduce a count of interconnect routes to the at least one FEM.

Wireless transceiver with remote frontend

An exemplary embodiment of the present invention described and shown in the specification and drawings is a transceiver with a receiver, a transmitter, a local oscillator (LO) generator, a controller, and a self-testing unit. All of these components can be packaged for integration into a single IC including components such as filters and inductors. The controller for adaptive programming and calibration of the receiver, transmitter and LO generator. The self-testing unit generates is used to determine the gain, frequency characteristics, selectivity, noise floor, and distortion behavior of the receiver, transmitter and LO generator. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or the meaning of the claims.

Adaptive radio transceiver

Adaptive radio transceiver with offset PLL with subsampling mixers

An unconditionally stable on-chip filter includes a filtering section and at least one negative resistance module. The filtering section is operably coupled to filter a signal and includes realizable integrated circuit passive components. The at least one negative resistance module is operably coupled to compensate for integrated circuit losses of the filtering section. The realizable integrated circuit passive components have values that are robust, in comparison to parasitic values, have minimal integrated circuit real estate, and provide realizable values for various integrated circuit manufacturing processes including CMOS technology.

Unconditionally stable filter

A low noise circuit includes a clocked circuit and an impedance trap circuit. The clocked circuit includes a clock input, an input, an output, a power supply connection, and a power return connection. The clock input is operably coupled to receive a clock signal. The clocked circuit provides an output signal at the output based on an input signal at the input and a transition of the clock signal. The power supply connection is operably coupled to a power supply and the power return is operably coupled to a circuit ground. The impedance trap circuit is operably coupled to the power supply connection and the power return connection, wherein the impedance trap circuit attenuates a harmonic signal component of at least one of the input signal, the clock signal, and the output signal.

Low noise circuit and applications thereof

Forming a wafer level chip scale flip chip package includes determining isolation requirements of an integrated circuit formed in a semi conductive substrate from package signal connections of the wafer level chip scale flip chip package. Operation may further include, based upon the integrated circuit characteristics, selecting a thickness of at least one dielectric layer isolating a top metal layer of the integrated circuit from the package signal connections of the wafer level chip scale flip chip package, determining a minimum pitch of the package signal connections of the wafer level chip scale flip chip package, and determining a maximum lateral distance from the signal pad to a servicing package signal connection of the wafer level chip scale flip chip package and determining a position of the servicing package signal connection of the wafer level chip scale flip chip package based upon the maximum lateral distance.

Wafer-level flipchip package with IC circuit isolation

Adaptive radio transceiver with a wide tuning range VCO

Adaptive radio transceiver with CMOS offset PLL

Growing community of inventors

Lake Forest, CA, United States of America

Jacob Jude Rael