Applied Materials, Inc.

Applied Materials Israel Limited

Verigy (singapore) Pte. Ltd.

Jacob Joseph Orbon, Jr

Ariel Ben-Porath

Youval Nehmadi

Ofer Bokobza

Alfred Larry Crouch

Vicky Svidenko

Rinat Shimshi

Richard C Dokken

Gerald Chan

Erez Ravid

Josephine Phua

Evgeny Levin

A method for operating a secure semiconductor IP access server to support failure analysis. A client presents a test failure and failure type to an automated server which traverses an electronic product design, definition, and test database to report specifically those components and interconnect likely to cause the failure with geometrical information which may be displayed on the client. Other aspects of semiconductor IP are protected by the server by limiting the trace mechanism and renaming components.

Method for operating a secure semiconductor IP server to support failure analysis

Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.

Grouping systematic defects with feedback from electrical inspection

A method for monitoring fabrication of an integrated circuit (IC) on a semiconductor wafer includes generating a product design profile (PDP) using an electronic design automation (EDA) tool, the PDP comprising an indication of a site in at least one layer of the IC that is susceptible to a process fault. Upon fabricating at least one layer of the IC on the wafer, a process monitoring tool is applied to perform a measurement at the site in at least one layer responsively to the PDP.

Design-based monitoring

Growing community of inventors

Morgan Hill, CA, United States of America

Jacob Joseph Orbon, Jr