Rosemount Inc.

Jacob Daniel Holm

George Charles Hausler

Christopher Lee Eriksen

Andrew John Wagener

Paul C Sundet

Ryan Thomas Lindsey

Glen Rodney Edwards

Chad M Mcguire

Sydney Jane Jones

Benjamin Hammerlind Jaffray

Steven J Mccoy

Timothy R Meschke

Jeffrey A Cota

A process variable transmitter is provided. The process variable transmitter includes a process variable sensor, and an electronics board having circuitry electrically coupled to the process variable sensor. The process variable transmitter also includes a shroud that holds the electronics board, and at least one stop feature to provide vibration damping. A method of manufacturing a process variable transmitter is provided. The method includes providing a process variable sensor. The method also includes providing an electronics board having circuitry configured to electrically couple to the process variable sensor. The method further includes forming a shroud to hold the electronics board, and forming at least one stop feature to support the electronics board when the electronics board is in the shroud.

Vibration damped electronics assemblies for process variable transmitters

Pressure transmitter housing design

An industrial process field device includes a pressure sensor, and a housing containing the pressure sensor. The housing includes a base having a base interface and a first base process opening. A flange is attached to the base and includes a flange interface having a first flange process opening. A first gasket process opening of a gasket is aligned with the first base process opening and the first flange process opening. A first surface of the gasket engages the base interface, and a second surface of the gasket engages the flange interface. A dielectric insulation system includes at least one dielectric layer that insulates the housing from electrical currents conducted through the flange. Each dielectric layer includes a layer of ceramic material, an anodized layer, or a plastic overmold, which improve a maximum working pressure of the field device.

Field device assembly including improved dielectric insulation system

Embodiments of the present disclosure are directed to field device housing assemblies and field devices that include the housing assemblies. One embodiment of the field device housing assembly includes a main housing, a cover having a proximal end connected to the main housing, a transparent panel and a retainer ring. An interior wall of the cover includes a threaded section that is concentric to a central axis, and a flange extending radially inward from the interior wall toward the central axis. The transparent panel is received within a socket defined by the interior wall and the flange. The retainer ring is secured to the threaded section of the interior wall. The transparent panel is clamped between the retainer ring and the flange.

Field device housing assembly

Growing community of inventors

Savage, MN, United States of America

Jacob Daniel Holm