Harris Corporation

Jacob A Davis

William R Morcom

Thomas J Sanders

A metallic ground grid is fabricated by forming a conductor on the isolation barrier of an integrated circuit through openings in a first insulated layer to a depth less than the first insulated layer, forming a second insulated layer on said first conductor to the height of the first insulated layer, and interconnecting selected areas of the integrated circuit and the first conductor through openings in the insulated layers by a second conductor.

Process for forming metallic ground grid for integrated circuits

A metallic ground conductor grid applied over a planar isolation barrier in an integrated circuit provides a low resistance ground. An insulating layer, formed over the ground conductor, has apertures therein for interconnecting selected areas of the integrated circuit to the ground conductor grid.

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Indialantic, FL, United States of America

Jacob A Davis