North American Specialties Corporation

Interplex Nas, Inc.

Liquistop LLC

Other

Nas Interplex Inc.

White Electronic Designs Corporation

American Specialties Corp.

Teka Interconnections Systems, Inc.

North American Specialities Corporation

Jack Seidler

James R Zanolli

Joseph S Cachina

Antonio F Coloneri

Robert N Taylor

Alan M Gulachenski

Joseph Praino

Aleksandr Zhitomirsky

Leonard J Pollock

A container lid for a fluid container is formed of a flexible resilient material includes a body member having a drinking aperture and a valve. Upon application of a first force to an actuator region of the body member, the valve unseals the drinking aperture and upon removal of the first amount of pressure, the valve reseals the aperture. Upon the application of a second force to the actuator region that is greater than the first force, the valve engages a locking mechanism and the aperture remains unsealed upon removal of the applied second force. In a second embodiment first and second actuator regions are employed and the application of a force to the second actuator region secures the valve in an unsealed orientation.

Container lid and valve including a locking mechanism

A lid for use with a fluid container includes a body member and a valve. The body member defines an aperture and includes a central portion that extends to an outer periphery configured to couple to a rim of a fluid container. In one embodiment, the body member and the valve and connected by an interconnecting portion which are formed as an integral single piece structure. The valve has a first portion directly secured to the bottom surface of the body member and a second free end portion that extends from the first portion. The second free end portion includes a protuberance and is movable relative to the first portion between a free state in which the protuberance seals the aperture and a depressed state obtained in response to downward deflection of the central portion of the body member relative to the outer periphery in which the aperture is unsealed.

Container lid and valve

A lid configured for use with a fluid container includes a body member and a valve. The body member includes a central body that extends to an outer periphery configured to couple to a rim of a fluid container. The body member defines an aperture therethrough and has top and bottom surfaces. The valve has a first portion directly secured to the bottom surface and a second portion that extends from the first portion. The second portion includes a protuberance and is movable relative to the first portion between free and depressed states in response to deflection of at least a portion of the central body relative to the outer periphery. The protuberance is configured for sealed engagement with the aperture while the second portion is in the free state and is spaced from the aperture while the second portion is in the depressed state.

A sliding mechanism includes two members, one of which is slidable with respect to the other along an axis. One of the members slides back and forth with respect to the other between a first position and a second position. A leaf spring is used as a positioning element to hold one of the members in either the first position or the second position. The leaf spring is attached to one of the two members and the other of the two members includes a projection. The leaf spring abuts the projection holding the slidable member in either the first position or the second position. When a user pushes one of the members from one position to another, the projection pushes the leaf spring out of the way until it passes an apex of the leaf spring and is held in the other position.

Sliding mechanism with spring positioning

A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.

Solder wire construction

In one aspect, a surface mount contact is provided for attachment to a circuit board or the like. The contact includes an elongated electrically conductive pin that has a first end and an opposing second end. A pre-formed heat re-flowable material is attached to one end of the pin and a conductive locator member surrounds the pin at a location between the first and second ends thereof and adjacent the conductive locator member. In one embodiment, the locator member is in the form of a cylindrical collar that extends around the pin.

Solder-bearing contacts and method of manufacture thereof and use in connectors

A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.

Method of retaining a solder mass on an article

An easily openable one-piece RF interference shield and method of manufacturing the same that is cost efficient and easily adapted for use with existing electrical devices. The RF shield having a plurality of interconnected sidewalls, a substantially open bottom region, and a hingeably connected top cover portion, having a top cover latch and disposed along the top edge of one of the sidewalls. The top cover portion of the shield is adapted to hinge toward another one of the sidewalls such that the top cover latch engages a hole disposed on the other sidewall being engaged and completing a protective enclosure about electrical components and preventing those components from causing electromagnetic interferences. The RF shield of the present invention allows for easy opening of the top cover portion to provide access to the enclosure for rework or repair of the electrical components covered by the shield, without having to unsolder the unit from a substrate containing the electrical components. The plurality of sidewalls include a first mating sidewall that is connected to a first intermediate sidewall, the first intermediate sidewall being connected to a second intermediate sidewall, and the second intermediate sidewall being connected to a second mating sidewall.

Openable one-piece electrical RF shield and method of manufacturing the same

A two-piece RF interference shield and method of manufacturing the same that is cost efficient and easily adapted for use with existing electrical devices. The RF shield includes a bottom portion mounted to the circuit board and a top portion which fits onto the bottom portion. The RF electrical interference shield can be mounted to circuit boards (e.g., by soldering) to prevent electrical components from causing RF interference. The RF shield of the present invention also allows for easy removal of the top of the RF shield so as to provide access to the interior for rework or repair of the electrical components covered by the shield, without having to unsolder the bottom portion of the shield. The two-piece shield for shielding an electrical component comprises a top portion and bottom portion that are fitted together so as to enclose the electrical components to be shielded. The top and bottom portions snap together, e.g., by way of barbs located on one of the portions that fit into corresponding holes or slots located on the other portion.

Two-piece electrical RF shield and method of manufacturing the same

A method of retaining a solder mass within a solder-bearing component is provided and includes the steps of: (a) forming a plurality of fingers in the solder-bearing component at one edge thereof, with each finger being defined by a pair of slots formed in the solder-bearing component; and (b) interleaving a solder mass between the fingers such that the solder mass is securely held by the fingers. The solder-bearing component includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.

Solder-bearing components and method of retaining a solder mass therein

An electromagnetic shield is provided and includes a shield body having an upper wall connected to opposing side walls and opposing end walls. At least two opposing walls of the electromagnetic shield each have a plurality of resilient fingers formed at a lower edge thereof. The electromagnetic shield also includes a solder mass securely held by the fingers by being interleaved between the fingers of each of the at least two opposing walls. The interleaving of the solder mass results in the solder mass being securely held by the fingers and ready for mounting to an electronic component for shielding a portion of the electronic component from undesirable and potentially damaging emissions from neighboring components. A method of mounting an electromagnetic shield to an electronic component having a planar surface and a method of interleaving the solder mass are also provided.

Solder-bearing electromagnetic shield

The present invention provides a method of forming a solder ball on a portion, e.g., one end, of a contact. In one exemplary embodiment, the contact is a terminal pin which is intended for use in an electrical connector and more particularly, for use in a solder ball grid array (SBGA) connector. Generally and according to one embodiment, the method includes providing the contact along with a solder-holding clip having a body with an opening. The body has a solder-holding conformation adjacent the opening and a solder mass is held by the conformation. The contact is then positioned proximate to the body opening and heat is applied to the solder mass causing the solder to reflow so that the solder flows into a spherical shape. This results in a solder ball being formed on the portion of the contact. Subsequent to forming the solder ball, the solder-holding clip is separated from the contact leaving a contact with a solder ball affixed thereto. Preferably, a series of solder-holding clips are provided along a carrier strip of material so that a number of solder balls may be formed on corresponding contacts during a single reflow operation.

Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connector

An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Growing community of inventors

Flushing, NY, United States of America

Jack Seidler