Electro Scientific Industries, Inc.

Jack Rundel

Mathew Noel Rekow

Haibin Zhang

Glenn Simenson

James Brookhyser

Michael John Darwin

Qian Xu

Fang Shan

Joe Frankel

Matthew Pysher

Min Zhang

The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth.

Method and apparatus for separation of workpieces and articles produced thereby

Growing community of inventors

Portland, OR, United States of America

Jack Rundel