Firestar Engineering, LLC

Micro Cooling Concepts, Inc.

Microvection, Inc.

Jack Merrill Fryer

Adam Pollok London

David J Fisher

Greg Mungas

Lloyd J Droppers

Geoff Campbell

Brian S Peotter

Geoffrey O Campbell

Diffusion bonding a stack of aluminum thin films is particularly challenging due to a stable aluminum oxide coating that rapidly forms on the aluminum thin films when they are exposed to atmosphere and the relatively low meting temperature of aluminum. By plating the individual aluminum thin films with a metal that does not rapidly form a stable oxide coating, the individual aluminum thin films may be readily diffusion bonded together using heat and pressure. The resulting diffusion bonded structure can be an alloy of choice through the use of a carefully selected base and plating metals. The aluminum thin films may also be etched with distinct patterns that form a microfluidic fluid flow path through the stack of aluminum thin films when diffusion bonded together.

Metallic thin-film bonding and alloy generation

The fluid and heat transfer theory for regenerative cooling of a rocket combustion chamber with a porous media coolant jacket is presented. This model is used to design a regeneratively cooled rocket or other high temperature engine cooling jacket. Cooling jackets comprising impermeable inner and outer walls, and porous media channels are disclosed. Also disclosed are porous media coolant jackets with additional structures designed to transfer heat directly from the inner wall to the outer wall, and structures designed to direct movement of the coolant fluid from the inner wall to the outer wall. Methods of making such jackets are also disclosed.

Regeneratively cooled porous media jacket

According to the invention, an apparatus for transferring heat with a target is disclosed. The apparatus may include a body which defines a surface, inlet port, inlet manifold passages, heat transfer passages, outlet manifold passages, and outlet port. The surface may couple the target with the body. The inlet port may be configured to receive and direct a fluid into inlet manifold passages. The inlet manifold passages may be configured to receive and direct the fluid to the heat transfer passages. The heat transfer passages may be configured to receive and direct the fluid in a direction substantially parallel to the surface and substantially perpendicular the input manifold passages. The outlet manifold passages may be configured to receive and direct the fluid to an outlet port. The outlet port may be configured to receive and output the fluid.

Microchannel cooling device for small heat sources

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Huntington Beach, CA, United States of America

Jack Merrill Fryer