International Business Machines Corporation

Jack M McCreary

Voya Rista Markovich

Richard Hsiao

Donald P Seraphim

Ho-Ming Tong

Irving Memis

Kurt R Grebe

Michael J Canestaro

James Steven Kamperman

Jeffrey D Jones

James V Ellerson

Steven L Bard

Gerald A Bendz

Barry A Bonitz

Edward Jay Frankoski

Darbha Suryanarayana

Gerald M Vettel

Kishen N Kapur

Michael S Horan

John R Chapura

John R Kjelgaard, Jr

An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board), the projecting conductive leads of the package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with encapsulant material (e.g., polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder. The invention has particular useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.

Method of making an electronic package assembly with protective

A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occurring within the same housing chamber which serves to collect the first fluid.

Fluid treatment apparatus

Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.

Solder interconnection structure on organic substrates and process for

Disclosed is a reworkable circuit .package formed by controlled collapse chip connection ('C4') bonding of integrated circuit chips to circuit cards and boards, and direct chip attachment ('DCA') where an encapsulant is disposed under the chip. The encapsulant offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. However, most encapsulants interfere with reworkability. The disclosed circuit package overcomes this problem by the provision of a passivating layer of Parylene is reworkable, dry processable, uniformly depositable by vapor phase deposition, forming thin films on facing surfaces at the 3-5 micron film thickness corresponding to the C4 lift-off distance.

Method of fabricating a reworkable module

Solder interconnection structure on organic substrates

Growing community of inventors

Apalachin, NY, United States of America

Jack M McCreary