Freescale Semiconductor,inc.

Marvell Asia Pte., Ltd.

Jack M Higman

James David Burnett

Shayan Zhang

Ertugrul Demircan

Prashant U Kenkare

Andrew Christopher Russell

Glenn Charles Abeln

Sanjay Parihar

Edward Outlaw Travis, Jr

Michael D Snyder

Bradford Lawrence Hunter

Thomas Jew

Troy L Cooper

Pierre Malinge

Qadeer A Qureshi

Lawrence N Herr

Zhewei Jiang

Sayeed Ahmed Badrudduza

Vivek Joshi

Pelley H Perry

Muhammed Ahosan Ul Karim

Xi Cao

Disclosed is a three-port static random access memory (3P-SRAM) that performs XNOR operations. The cell has a write port and first and second read ports. Read operations are enabled through either the first read port using a first read wordline and a common read bitline or the second read port using a second read wordline and the common read bitline. Read wordline activation is controlled such that only one read wordline is activated (i.e., receives a read pulse) at a time. As a result, a read operation through either read port effectively accomplishes an XNOR operation. Also disclosed is a memory array, which incorporates such cells and which performs XNOR-bitcount-compare functions. Since XNOR-bitcount-compare functions are used in XNOR-NET type binary neural networks (BNNs), the memory array can be employed for implementing such a BNN designed for improved performance, scalability, and manufacturability. Also disclosed is an in-memory computing method.

Three-port memory cell and array for in-memory computing

An SRAM has at least two sets of pass transistors for coupling at least two sets of bit lines to true and complement data nodes of an SRAM cell based on the assertion of at least two word lines. The cell includes two pull up transistors and two pull down transistors coupled to the true and complement data nodes. None of the pass transistors are implemented in an active area that includes a pull up transistor or a pull down transistor of the cell.

Dual port static random access memory cell

An integrated circuit has a plurality of terminals for making electrical connection to the integrated circuit. At least one device is formed adjacent an outer edge of the integrated circuit. The device includes at least one metal conductor for forming an edge seal for protecting the integrated circuit during die singulation. The device is coupled to one or more functional circuits within the integrated circuit by routing the at least one metal conductor to the one or more functional circuits, the at least one device providing a reactance value to the one or more functional circuits for non-test operational use. The device may be formed as one or more capacitors or as one or more inductors. Various structures may be used for the capacitor and the inductor.

Integrated circuits with edge-adjacent devices having reactance values

A memory and method for access the memory are provided. A first test is used to test memory elements to determine a lowest power supply voltage at which all the memory elements will operate to determine a weak memory element. Redundancy is used to substitute a redundant memory element for the weak memory element. The weak memory element is designated as a test element. In response to receiving a request to change a power supply voltage provided to the memory elements, a second test is used to test the test element to determine if the test element will function correctly at a new power supply voltage. If the test element passes the second test, the memory elements are accessed at the new power supply voltage. If the test element fails the second test, the memory elements are accessed using an access assist operation.

Integrated circuit memory having assisted access and method therefor

A dual port static random access memory cell has pull-down transistors, pull-up transistors, and pass transistors. A first active region has a first pull-down transistor coupled to a true data node, a second pull-down transistor coupled to a complementary data node; a first pass transistor coupled to the true data node, and a second pass transistor coupled to the complementary data node. A second active region has the same size and shape as the first active region and has a third pull-down transistor coupled in parallel to the first-pull down transistor, a fourth pull-down transistor coupled in parallel to the second pull-down transistor; a third pass transistor coupled to the true data node, and a fourth pass transistor coupled to the complementary data node. A first pull-up transistor and a second pull-up transistor are located between the first and second active regions.

Dual port static random access memory cell layout

A memory has a first bit line, a second bit line, and a word line. A memory cell is coupled to the word line and the first and second bit lines. A sense amplifier has a first input, a second input, a first output, and a second output. A pair of coupling transistors includes a first transistor and a second transistor. In one embodiment, the first transistor is coupled between the first bit line and the first input of the sense amplifier and the second transistor is coupled between the second bit line and the second input of the sense amplifier. A write back circuit is coupled to an output of the sense amplifier. The write back circuit writes back to the memory cell a value read from the memory cell during a read cycle.

Memory with read cycle write back

Test circuitry for determining whether a memory can operate at a lower operating voltage. The test circuitry includes a sense circuit having a delayed sensing characteristic as compared to other sense amplifier circuits of the memory. With this circuitry, the test circuitry can determine if the sense circuit can provide valid data under more severe sensing conditions. In one example, the sense circuit includes a delay circuit in the sense enable signal path. If sense circuit can provide data at more server operating conditions, then the memory operating voltage can be lowered.

Memory operation testing

Semiconductor device with capacitor and/or inductor and method of making

A memory cell including an access transistor coupled to a first storage node and a read port coupled to one of the first storage node or a second storage node is provided. The memory cell further includes a first inverter having an input terminal coupled to the first storage node, an output terminal, and a first power supply voltage terminal for receiving a first power supply voltage. The memory cell further includes a second inverter having an input terminal coupled to the output terminal of the first inverter, an output terminal coupled to the input terminal of the first inverter at the first storage node, and a second power supply voltage terminal for receiving a second power supply voltage, wherein the second power supply voltage is varied relative to the first power supply voltage during a write operation to the memory cell.

Memory cells with lower power consumption during a write operation

A method for adjusting an operating parameter of an integrated circuit having a memory and logic, where the logic includes a timing circuit, includes accessing the memory, determining a relative speed of the memory access with respect to a speed of the timing circuit, and selectively adjusting the operating parameter based on the relative speed. In one embodiment, an integrated circuit may include a ring oscillator, a shift register having a clock input coupled to an output of the ring oscillator, and compare logic coupled to an output of the shift register. The shift register is enabled in response to initiating a memory access to a memory and disabled in response to completing the memory access. The compare logic provides a relative speed indicator representative of a relative speed of the memory.

Apparatus and method for adjusting an operating parameter of an integrated circuit

A two-port SRAM memory cell includes a pair of cross-coupled inverters coupled to storage nodes. An access transistor is coupled between each storage node and a write bit line and controlled by a write word line. The write word line is also coupled to a power supply terminal of the pair of cross-coupled inverters. During a write operation, the write word line is asserted. A voltage at the power supply terminal of the cross-coupled inverters follows the write word line voltage, thus making it easier for the stored logic state at the storage nodes to change, if necessary. At the end of the write operation, the write word line is de-asserted, allowing the cross-coupled inverters to function normally and hold the logic state of the storage node. Coupling the power supply node of the cross-coupled inverters allows faster write operations without harming cell stability.

Two-port SRAM having improved write operation

A method for forming an integrated circuit () comprises accessing () a library of primitive cells and edge codes in the formation of an integrated circuit layout. At least one edge code of at least one previously placed primitive cell () of the integrated circuit layout is used. A primitive cell is selected () from the library that is compatible with the at least one previously placed primitive cell and the selected primitive cell is placed into the integrated circuit layout adjacent the at least one previously placed primitive cell. The integrated circuit is manufactured () using the integrated circuit layout.

Primitive cell method for front end physical design

An electronic device includes a memory cell that utilizes a bi-directional low impedance, low voltage drop full pass gate to connect a bit cell to a bit write line during a write phase, and during a read phase the full pass gate can remain off and a high input impedance read port can acquire and transmit the logic state stored by the memory cell to another subsystem. The full pass gate can be implemented by connecting a P type metal semiconductor field effect transistor (PMOS) in parallel with an NMOS device and driving the gates of the transistors with a differential signal. When a write operation requires a current to flow in a first direction, the PMOS device provides a negligible voltage drop, and when the write operation requires current to flow in a second or the opposite direction, the NMOS device can provide a negligible voltage. This bi-directional low voltage drop low loss switch can increase the write margin of the memory cell wherein the high impedance read port can provide increased isolation for the stored value during the read phase increasing the performance of the memory cell.

Growing community of inventors

Austin, TX, United States of America

Jack M Higman