Asm International N.v.

Jack Herman Van Putten

Frank Huussen

Theodorus Gerardus Maria Oosterlaken

Albert Hasper

Herbert Terhorst

Jan Zinger

Gert-Jan Snijders

Cornelis Marinus Kooijman

Jeroen Jan Stoutjesdijk

Christianus Gerardus Maria Ridder

A semiconductor processing reactor comprises a reaction chamber with a gas exhaust and a mechanical seal at one end of the chamber. The seal seals off the chamber from the ambient environment and is purged with gas to prevent diffusion of ambient gases into the reaction chamber. Because the purge gas can diffuse through the seal into the reaction chamber, the purge gas is chosen based upon the process gas and the location of the seal and exhaust so that the molecular weight of the purge gas causes the purge gas, by the force of gravity or buoyancy, to remain in the portion of the reaction chamber containing the seal and the gas exhaust. Advantageously, keeping the purge gas at the same end of the chamber as the gas exhaust minimizes dilution of the process gas with the purge gas, thereby preventing the purge gas from detrimentally effecting process results.

Method and apparatus for purging seals in a thermal reactor

Enhanced inserts are formed having a cylindrical grip and a protrusion extending from the grip. An ultra hard material layer is bonded on top of the protrusion. The inserts are mounted on a rock bit and contact the earth formations off center. The ultra hard material layer is thickest at a critical zone which encompasses a major portion of the region of contact between the insert and the earth formation. Transition layers may also be formed between the ultra hard material layer and the protrusion so as to reduce stresses formed on the interface between the ultra hard material and the protrusion.

Method and device for transferring wafers

A furnace includes a core tube that has an elongate boundary wall and is configured to accommodate wafers for processing the wafers in a treatment atmosphere. The furnace includes a cooling chamber defined between the elongate boundary wall and an outer casing of the furnace, wherein the outer casing includes a heating element and has first lateral, circumferentially spaced openings in proximity of a first end of the outer casing and second lateral, circumferentially spaced openings in proximity of a second end of the outer casing. Cooling gas is supplied through one of the first and second lateral, circumferentially spaced openings to a region of one end of the cooling chamber and provides for a cooling atmosphere. The cooling gas is guided along the cooling chamber with a uniform distribution of flow and discharged through one of the first and second lateral, circumferentially spaced openings from a region of an opposite end of the cooling chamber. A direction of flow of the cooling gas is periodically reversed during cooling, wherein the cooling gas is guided along an essentially closed circuit so that the cooling gas is preserved and so that the cooling atmosphere is separated from the treatment atmosphere. A liquid-gas heat exchanger cools the cooling gas.

Method for cooling a furnace, and furnace provided with a cooling device

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Den Dolder, Netherlands

Jack Herman Van Putten