Texas Instruments Corporation

Jack D Grimmett

Steven Edward Smith

Satyan R Kalyandurg

Ronald C Creech

A method for removing heat from a spatial light modulator device in a digital projection display by encapsulating the device package in a thermal conductive socket attached to a printed wiring board. The socket wraps around the device package to remove both optically generated heat from the front of the device and electrically generated heat within the device. In higher brightness projector applications, fins are added to the socket to increase the mass and surface area of the socket, thereby improving the heat dissipation properties of the system. The heat sink socket attaches to the printed wiring board using a screw attachment means, which also assures electrical connectivity to the spatial light modulator through a interposer element between the device and spatial light modulator. This approach completely eliminates conventional heat sinks, mounting studs, and fasteners, which have been failure mechanisms in these type displays.

DMD heat sink socket assembly

A six-axis attachment mechanism for aligning a spatial light modulator ( ) within a display system. An attachment plate ( ) has one or more pins ( ) extending therefrom. A socket plate ( ) onto which a spatial light modulator ( ) is attached slides over the pins ( ). The modulator is then positioned to optically align it with the remainder of the display system. As the modulator is held in alignment, a washer ( ) is slid onto the pin ( ) and is bonded to both the pin ( ) and to the socket plate ( ). Washers ( ) are typically transparent to enable the use of an optically cured adhesive. Glass washers ( ) allow ultraviolet radiation to reach the adhesive through the glass washer ( ).

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Carrollton, TX, United States of America

Jack D Grimmett