Signetics

Quintel Corporation

Jack C Lane

Ernest J Funk

Mark R Schneider

Thomas Wing

Floyd F Oliver

Edward F Duffek

Edward S Westbrook, Iv

Alfred S Jankowski

William L Lehner

A locking device for use in the chuck of an optical alignment and exposure apparatus is disclosed. The locking device comprises a plurality of flat, flexible blades fastened in pairs to a chuck plate in the chuck. Between each pair of blades there is a stationary element fastened to a base member in the chuck. Vacuum cups are fastened to the blades so that the blades are clamped tightly against the stationary element when the vacuum cups are evacuated.

Locking mechanism for use in a chuck for an optical alignment and

Semiconductor devices containing integrated circuits are attached directly to external package leads by pressing simultaneously a plurality of groups of leads against bonding pads on a plurality of face-up semiconductor dice and heating the composite structures. Solder bumps on the bonding pads contain hard pedestals which prevent the overlying leads from being pushed into the faces of the semiconductor devices while the solder on the solder bumps melts to form the bonds between the leads and the underlying semiconductor dice. The process for carrying out this operation lowers significantly the cost of each packaged semiconductor device and the resulting structure is more reliable than structures of the prior art.

Two part package for a semiconductor die

Growing community of inventors

Saratoga, CA, United States of America

Jack C Lane