International Business Machines Corporation

Jack A Varcoe

James V Ellerson

Joseph Funari

Voya Rista Markovich

Paul Alfred Lauro

George Frederick Walker

Jerome J Cuomo

Sung Kwon Kang

David Noel Light

Douglas Oliver Powell

Anthony P Ingraham

John J Ritsko

Thomas P Gall

Jaynal Abedin Molla

Perminder S Bindra

Jungihl Kim

George J Saxenmeyer, Jr

Richard Joseph Noreika

Ekkehard F Miersch

Ronald J Moore

Louis J Konrad, Iii

Solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate is provided. Located on the carrier substrate are electrodes and located between the electrodes and integrated semiconductor device are solder connections that have a relatively low melting point such that when the device is in operation, the solder connection will liquify thereby permitting expansion compensation between the substrate and semiconductor device.

Interconnection of a carrier substrate and a semiconductor device

An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board). The assembly's projecting conductive leads are soldered. An encapsulant material (e.g., polymer resin) is used to provide reinforcement for the solder-lead connections, the encapsulant material being dispensed only along opposing sides of the package's housing which do not include projecting leads (and which are oriented substantially normal to the stresses imposed on the package during operation wherein high temperatures are attained). This dispensing may follow solder reflow and solidification. The invention is particularly useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.

Method of making electronic package assembly with protective encapsulant

Electronic package assembly with protective encapsulant material on

A method and apparatus for selectively spray etching an epoxy encapsulated chip which is mounted to a chip carrier without damage to the chip, the chip carrier or other closely mounted chips. The apparatus includes a diaphragm which can be raised and lowered to direct the flow of etchant solution at the encapsulating material located alongside and under the chip. The encapsulating material is removed from the chip without removing the chip from the chip carrier.

Apparatus and method for selectively etching a plastic encapsulating

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Method of fabricating nendritic materials

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Separable electrical connection technology

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Endwell, NY, United States of America

Jack A Varcoe