Other

Hyundai Motor Company

Kia Corporation

Dr Axion Co., Ltd.

Ja Uk Koo

Kimyoung Kwon

Sangbum Kim

Ji Hun Son

Hyoung Chan Kim

Kyoung Young Kim

A motor plate type coil forming apparatus forms a plate type coil wound on a stator of a motor by a squeeze casting method. In particular, the apparatus includes: i) a main frame including a lower frame and an upper frame; ii) a mold unit including a lower mold elastically connected to the lower frame to be movably installed in a vertical direction, and an upper mold movably installed in the upper frame in the vertical direction corresponding to the lower mold; and iii) a molten metal pressurizing unit including a plunger that is movably installed in the lower frame in a vertical direction corresponding to the lower mold. In particular, the lower mold may include a sleeve provided to be vertically coupled to the plunger, and a plurality of coil forming parts provided to form a cavity connected to the sleeve.

Motor plate type coil forming apparatus

A flip chip bonding method and substrate architecture are disclosed for enhancing bonding performance between a chip and a substrate by forming a bump on the chip or the substrate. The flip chip bonding method includes performing pretreatment of a wafer having chips, dicing, and obtaining the pretreated individual chip; performing pretreatment of a substrate; aligning the pads of the pretreated chip with the pads of the pretreated substrate, and bonding the chip and the substrate together by applying an ultrasonic wave and heat using a collet and simultaneously applying pressure. Post treatment is performed by filling or molding resin after bonding. The chip or the substrate is formed with a plated bump, a stud bump or a wedge bump. The stud bump or the wedge bump can be additionally formed on the plated bump.

Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same

Growing community of inventors

Yangsan-si, South Korea

Ja Uk Koo