Itm Semiconductor Co., Ltd.

Ja Guen Gu

Ho Seok Hwang

Hyuk Hwi Na

Hyang Won Kang

Sun Ho Kim

Seong Beom Park

Hyung Jin Lim

Dong Hee Lee

Yeong Seol Kwon

Chi Sun Song

Provided is a battery control system-in-package including a package substrate, a wireless charger integrated circuit (IC) module mounted on the package substrate, a wired charger IC module mounted on the package substrate, a battery protection IC module mounted on the package substrate, and a single mold provided on the package substrate to encapsulate the wireless charger IC module, the wired charger IC module, and the battery protection IC module.

Battery control system-in-package and method of fabricating the same

Provided is a pressure sensor apparatus including a lead frame, a pressure sensing element mounted on the lead frame to measure a relative pressure between a first part and a second part, and a housing including a reference medium inlet hole to apply a pressure of a reference medium to the first part, and including a target medium inlet hole to apply a pressure of a target medium to the second part, wherein the reference medium inlet hole is provided in a first surface of the housing, wherein the target medium inlet hole is provided in a second surface of the housing other than the first surface, and wherein the lead frame includes one or more insertion terminals configured to be inserted into and electrically connected to terminal holes of a wire connector.

Pressure sensor apparatus and method for manufacturing pressure sensor apparatus and pressure sensor assembly

Provided are a multi-sensor device capable of implementing a pressure sensor function and an acceleration sensor function by using one housing, and a method of manufacturing the multi-sensor device. The multi-sensor device may include a lead frame, a pressure sensing element electrically connected to the lead frame and being capable of measuring a relative pressure between a first part and a second part thereof, an acceleration sensor module electrically connected to the lead frame and being capable of measuring acceleration applied to an ambient environment thereof, and a housing mounted to protect at least a part of the lead frame, the pressure sensing element, and the acceleration sensor module, including a reference medium inlet hole to apply a pressure of a reference medium to the first part, and including a target medium inlet hole to apply a pressure of a target medium to the second part.

Multi-sensor device and method for manufacturing multi-sensor device

Provided are a pressure sensor device and a method of manufacturing the same. The pressure sensor device includes a housing including an air inlet and a fluid inlet provided in different directions, a substrate provided in an inner space of the housing and including a through-hole through which the air passes, and a pressure sensor chip mounted on the substrate to cover the through-hole in such a manner that a pressure of a fluid flowing in from the fluid inlet is applied to a top surface thereof and a bottom surface thereof is exposed to the air through the through-hole, in order to measure the pressure of the fluid relative to a pressure of the air, wherein the inner space is divided into an upper region and a lower region with respect to the substrate, and wherein the upper region is divided into a first inner region in which the pressure sensor chip is provided and a second inner region through which the air passes.

Growing community of inventors

Chungcheongbuk-do, South Korea

Ja Guen Gu