Kollmorgen Technologies Corporation

Kollmorgen Corporation

J Philip Plonski

Michael Vignola

Leonard Shieber

Benjamin G Chin

In making coaxial interconnection boards according to this invention coaxial conductors are scribed onto a circuit board substrate. The coaxial conductors are preformed and affixed in a predetermined pattern on the substrate using an adhesive. A conductive layer forming a ground plane covers the surface of the substrate interconnecting the shields of the coaxial conductors. The conductive material other than the coaxial signal conductors is eliminated around the termination points of the coaxial conductors thereby creating clearance areas. The clearance areas permit connection of the signal conductors to surface terminal pads without shorting to the shield conductors or ground planes.

Method of making coaxial interconnection boards

Coaxial interconnection boards

An interconnection board for high frequency signals is made by wire scribing coaxial conductors. The board is provided with holes. The coaxial conductors with signal conductor surrounded by a dielectric in turn surrounded by a conductive shield are wire scribed on a first surface of the board. The ends of the coaxial conductors are stripped to expose signal conductor sections, and dielectric sections. The stripped ends are inserted through the holes so that the dielectric sections reside in the holes and the exposed signal conductors protrude through the holes on the second surface of the board. The signal conductors are terminated on the second surface, and the conductive shields are connected together on the first surface.

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Huntington, NY, United States of America

J Philip Plonski