Rogers Corporation

World Properties, Inc.

J Mark Mersereau

Vincent R Landi

Walter A Robbins

Michael E St Lawrence

Linwood A Walters

Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250&deg; C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper).

Method of manufacture of polybutadiene and polyisoprene based thermosetting compositions

A forming process for producing a hard shaped molded article that includes subjecting a moldable thermosetting composition to a high temperature cure condition at a temperature greater than about 250.degree. C. and less than the decomposition temperature of the composition to form a crosslinked polymeric network. In particular, the invention features a forming process for producing a hard shaped molded article that includes the steps of

Process for forming hard shaped molded article of a cross-linked liquid

The bonding of phenolic resins and phenolic molding materials to copper is significantly improved by the addition to the phenolic material of elemental sulfur in a weight percentage from 0.005% to 1%, the weight percentage of sulfur being preferably from 0.01% to 0.2%.

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Brooklyn, CT, United States of America

J Mark Mersereau