Dow Global Technolgoies LLC

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

The Dow Chemical Company

Rohm and Haas Company

University of Illinois

J Keith Harris

Christopher John Tucker

Thomas H Kalantar

Hamed Lakrout

Donald L Schmidt

David L Malotky

Gene D Rose

Michael Leo Tulchinsky

Susan L Jordan

Richard F Fibiger

Xiaodong Zhang

Francis J Kelley

Joseph Letizia

Jinjie Shi

Xu Li

Mladen Ladika

Jin Zhao

Steven C Zimmerman

Richard S Harner

David J Forgach

William A Heeschen

Chaofang Yue

Joshua S Katz

David A Hayes

Linda A Moore

Paul G Glugla

Mary Beth Seasholtz

Jessica L Bell

Larisa Mae Q Reyes

Brittany A Walker

Joaquin M Garcia

Larisa Mae Reyes

A method of scale inhibition treatment of a water system comprising introducing an aqueous scale inhibiting composition into the water system wherein the aqueous scale inhibiting composition comprises a carboxylated hyperbranched polyglycerol.

Scale inhibitor methods and compositions

The present invention relates to the use of polyalkoxylated alcohols of the formula R&#x2014;O-(AO)&#x2014;H, wherein R is a substituted or unsubstituted alkyl, alkenyl, alkynyl, aryl, aralkyl or heterocyclic group having 7 to 25 carbon atoms, (AO) is a polyoxyalkylene moiety of the composition (BO)m(EO)n(DO)r with random or blockwise arrangement of the constituting oxyalkylene units, wherein m, n and r represent the average number of oxybutylene (BO) units, oxyethylene (EO) units and oxyalkylene units derived from at least one epoxide selected from styrene oxide and alkylene oxides having from 5 to 10 carbon atoms (DO) per molecule of the polyalkoxylated alcohol, respectively, m being a number greater than or equal to 1, n being a number greater than or equal to 1 and r being a number in the range from 0 to 50 under the proviso that (m+n+r) is less than or equal to 200 and the ratio n/(m+r) is in the range of 1 to 20, as excipients in pharmaceutical compositions. Said polyalkoxylated alcohols enable very effective solubilization of poorly soluble active pharmaceutical ingredients in aqueous media. Solid or semi-solid pharmaceutical compositions comprising one or more such polyalkoxylated alcohol combined with at least one active pharmaceutical ingredient are further long term stable under typical storage conditions and can be readily provided in various dosage forms such as tablets and filled capsules.

Polyalkoxylated alcohols as excipients for pharmaceutical compositions

Described are fabric care compositions, comprising a builder and an aqueous dispersion comprising an ethylene acrylic acid copolymer and a fragrance.

Ethylene acrylic acid copolymer aqueous dispersions for fragrance release in laundry detergents

Described are devices for retaining a nonporous substrate, as well as methods for their use, the devices comprising a housing for receiving the nonporous substrate, a removable well insert attached to the housing and adjacently coplanar to the substrate, the well insert having at least one opening that, together with the substrate, defines a well, and means for exerting a force against the substrate such that the substrate engages the well insert with sufficient force to attain a fluid-tight seal in the well.

Devices for retaining a nonporous substrate and methods

A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a Calkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.

Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition

A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; a water soluble cellulose; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a Calkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method of preparing a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.

Stable, concentratable chemical mechanical polishing composition and methods relating thereto

The present invention relates to a turbidity calibration standard comprising: a number of from 1 to 5 sequentially-interfaced layers, wherein each layer independently comprises a light-permeable polymer or light-permeable interpolymer; a measured light transmission modulating amount of at least one light transmission modulator, which is distributed in any one or more of the layers; and a light-permeable container, which contains the layers and the at least one light transmission modulator. Also, the invention relates to methods of making and using the standard, and kits comprising the standard.

Stable turbidity calibration standards

A process is disclosed for the formation of a high flux composite membrane having a thin discriminating film affixed to a porous support layer through a glue layer. The process comprises the formation of the discriminating film by irradiating an aqueous polymer solution in the substantial absence of drying and under conditions which are sufficient to form a polymer film on the surface of the polymer solution at the interphase of the solution and a blanketing fluid. The film is then affixed to the support through the glue layer which may be the same polymer solution from which the discriminating film is formed.

Process of preparing a composite membrane

Growing community of inventors

Midland, MI, United States of America

J Keith Harris