Ansys, Inc.

Sas Ip, Inc.

J Eric Bracken

Werner Thiel

Jacob K White

Michael J Tsuk

Lars Eric Rickard Petersson

Xin Xu

Guangran Zhu

John Bosley Manges

Systems and methods are provided for constructing a physical transmission line system. Characteristic data associated with a transmission line system is received. A model of the transmission line system is built based on the characteristic data. Building a model of the transmission line system includes determining a characteristic admittance matrix based on the characteristic data, determining a propagation function matrix based on the characteristic data, calculating a linking matrix based on the characteristic admittance matrix and the propagation function matrix, and determining a state space model based on the characteristic admittance matrix and the linking matrix. A simulation is performed using the state space model to determine a physical characteristic, where the transmission line system is built or modified based on the simulation-determined physical characteristic.

Processor-implemented systems and methods for multi-conductor transmission line simulation

Systems and methods are provided for generating an equivalent circuit model. RLGC parameters representing a segment of a layered structure of a specified length are received. The layered structure includes two conductors (also called planes) and at least one trace or a transmission line located between the two conductors. An admittance matrix corresponding to the segment is computed based at least in part on the received RLGC parameters. One or more loading parameters representing a loading of one of the two conductors due to the trace or traces are also computed, and a segment circuit model for the segment of the layered structure based at least in part on the admittance matrix and the one or more loading parameters.

Systems and methods for full-order equivalent circuit approach (ECA) modeling of layered structures

Systems and methods are provided for analyzing a via. A physical representation of a via intersecting with an upper layer and a lower layer is received, the physical representation comprising: (i) a pair of pad dimensions comprising an upper pad dimension aand a lower pad dimension a, and/or (ii) a pair of anti-pad dimensions comprising an upper anti-pad dimension band a lower anti-pad dimension b, where at least one of first and second conditions: (A) the first condition being ais different than a, and (B) the second condition being bis different than b, is true. A determination is made as to which, if any, of the conditions are true. At least one model parameter is selected based on the determination. An admittance parameter corresponding to a section of the via located between the upper and lower layers is computed using the selected model parameter.

Systems and methods for modeling asymmetric vias

Disclosed are system and methods for simulating signal integrity structures using stable processed modes (e.g., matched traveling-wave power modes), and/or for creating response surfaces from stable response parameters.

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Harrison City, PA, United States of America

J Eric Bracken