Kovio, Inc.

Thin Film Electronics Asa

Cambridge Enterprise Limited

Cambridge University Technical Services Limited

Kovlo, Inc.

J Devin MacKenzie

Christopher S Gudeman

James Montague Cleeves

Joerg Rockenberger

Fabio R Zurcher

Vik Pavate

Max Davis

Dan Good

Criswell Choi

Richard Henry Friend

Arvind Kamath

Ana Claudia Arias

Vikram Pavate

Wilhelm Huck

Jose Arreola

J Montague Cleeves

Patrick Smith

Ikuo Mori

Partick Smith

A MOS RF surveillance and/or identification tag, and methods for its manufacture and use. The tag generally includes an interposer, an antenna and/or inductor on the interposer, and integrated circuitry on the interposer in a location other than the antenna and/or inductor. The integrated circuitry generally has a lowest layer in physical contact with the interposer surface. The method of manufacture generally includes forming a lowest layer of integrated circuitry on an interposer, forming successive layers of the integrated circuitry on the lowest layer of integrated circuitry, and attaching an electrically conductive functional layer to the interposer. Alternatively, an electrically conductive structure may be formed from a functional layer attached to the interposer. The method of use generally includes causing and/or inducing a current in the present tag sufficient for it to generate, reflect or modulate a detectable electromagnetic signal, detecting the signal, and optionally, processing information conveyed by the detectable electromagnetic signal. The present invention advantageously provides a low cost RFID tag capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional RFID tags that manufacture all active electrical devices on a conventional wafer.

RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same

Methods, algorithms, processes, circuits, and/or structures for laser patterning suitable for customized RFID designs are disclosed. In one embodiment, a method of laser patterning of an identification device can include the steps of: (i) depositing a patternable resist formulation on a substrate having configurable elements and/or materials thereon; (ii) irradiating the resist formulation with a laser tool sufficiently to change the solubility characteristics of the resist in a developer; and (iii) developing exposed areas of the resist using the developer. Embodiments of the present invention can advantageously provide a relatively low cost and high throughput approach for customized RFID devices.

Laser processing enabling radio frequency identification (RFID) customization

Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g., improved electrical characteristics) as compared to tags containing organic electronic devices.

Methods for manufacturing RFID tags and structures formed therefrom

A RF MOS- or nonlinear device-based surveillance identification tag, and methods for its manufacture and use. The tag includes an inductor, a capacitor plate coupled to the inductor, a dielectric film on the capacitor plate, a semiconductor component on the dielectric film, and a conductor providing electrical communication between the semiconductor component and the inductor. The method of manufacture includes depositing a semiconductor material/precursor on a dielectric film; forming a semiconductor component from the semiconductor material/precursor; forming a conductive structure at least partly on the semiconductor component; and etching the electrically functional substrate to form an inductor and/or a second capacitor plate. The method of use includes causing/inducing a current in the tag sufficient to generate detectable electromagnetic radiation; detecting the radiation; and selectively deactivating the tag. The present invention provides a low cost tag capable of operating at MHz frequencies and in frequency division and/or multiplication modes.

MOS electronic article surveillance, RF and/or RF identification tag/device, and methods for making and using the same

A MOS RF surveillance and/or identification tag, and methods for its manufacture and use. The tag includes an interposer, an antenna/inductor, and integrated circuitry on the interposer. The integrated circuitry has a lowest layer in physical contact with the interposer. The method of manufacture includes forming a lowest layer of integrated circuitry on an interposer, forming successive layers of the integrated circuitry on the lowest layer of integrated circuitry, and attaching an electrically conductive functional layer to the interposer. Alternatively, an electrically conductive structure may be formed from a functional layer attached to the interposer. The method of use includes causing/inducing a current in the present tag sufficient for it to generate, reflect or modulate a detectable electromagnetic signal, detecting the signal, and optionally, processing information conveyed by the detectable electromagnetic signal.

A light-emissive device comprising a light-emissive material provided between first and second electrodes such that charge carriers can move between the first and second electrodes and the light-emissive material, wherein the device includes a layer of a polymer blend provided between the first and second electrodes, phase separation of the polymers in the polymer blend having been induced in at least a portion of the polymer blend so as to control the propagation of light emitted by the light-emissive material in a predetermined direction.

Optoelectronic devices and a method for producing the same

A MOS transistor with a laser-patterned metal gate, and methods for its manufacture. The method generally includes forming a layer of metal-containing material on a dielectric film, wherein the dielectric film is on an electrically functional substrate comprising an inorganic semiconductor; laser patterning a metal gate from the metal-containing material layer; and forming source and drain terminals in the inorganic semiconductor in locations adjacent to the metal gate. The transistor generally includes an electrically functional substrate; a dielectric film on at least portions of the electrically functional substrate; a laser patterned metal gate on the dielectric film; and source and drain terminals comprising a doped inorganic semiconductor layer adjacent to the metal gate. The present invention advantageously provides MOS thin film transistors having reliable electrical characteristics quickly, efficiently, and/or at a low cost by eliminating one or more conventional photolithographic steps.

MOS transistor with laser-patterned metal gate, and method for making the same

A RF MOS- or nonlinear device-based surveillance and/or identification tag, and methods for its manufacture and use. The tag generally includes (a) an inductor, (b) a first capacitor plate coupled to the inductor, (c) a dielectric film on the first capacitor plate, (d) a semiconductor component on the dielectric film, and (e) a conductor that provides electrical communication between the semiconductor component and the inductor. The method of manufacture generally includes (1) depositing a semiconductor material (or precursor) on a dielectric film; (2) forming a semiconductor component from the semiconductor material/precursor; (3) forming a conductive structure at least partly on the semiconductor component; and (4) etching the electrically functional substrate to form (i) an inductor and/or (ii) a second capacitor plate. The method of use generally includes (i) causing/inducing a current in the present tag sufficient for it to generate detectable electromagnetic radiation; (ii) detecting the radiation; and optionally, (iii) selectively deactivating the tag. The present invention advantageously provides a low cost EAS/RFID tag capable of operating at MHz frequencies and in frequency division and/or frequency multiplication modes.

An EAS device, and methods for making the device for tuning the resonant frequency of the same is disclosed. The EAS device includes: an outer inductor having one end coupled to a linear or nonlinear capacitor plate; an inner inductor having one end coupled to the other type of capacitor; a first dielectric film on the outer and inner inductors and the capacitor plates coupled thereto, having openings exposing other ends of the outer and inner inductors; a second linear capacitor plate on the dielectric film; a second nonlinear capacitor plate on the dielectric film; a second dielectric film containing holes for the second linear and nonlinear capacitor plates, and exposing the other ends of the first and second inductors; and first and second conducting straps on the second dielectric film, configured to electrically connect one of the exposed inductor ends to a corresponding second capacitor plate.

Electronic article surveillance (EAS) tag/device with coplanar and/or multiple coil circuits, an EAS tag/device with two or more memory bits, and methods for tuning the resonant frequency of an RLC EAS tag/device

An electronic article surveillance (EAS) tag/device with coplanar and/or multiple coil circuits, a tag/device with two or more memory bits, and methods for making and tuning the resonant frequency of an EAS tag/device. The device generally includes: an outer inductor having one end coupled to a capacitor plate; an inner inductor having one end coupled to an other capacitor plate; a first dielectric film on the outer and inner inductors and the capacitor plates coupled thereto, having openings therein exposing other ends of the outer and inner inductors; a linear capacitor plate and a nonlinear capacitor plate on the first dielectric film; a second dielectric film containing holes therein for the second linear and nonlinear capacitor plates, and exposing the other ends of the first and second inductors; and first and second conducting straps on the second dielectric film, electrically connecting one of the exposed inductor ends to a corresponding second capacitor plate.

Methods for repairing an electrical circuit; compositions, inks and equipment for making such repairs; and repair structures formed by the methods. The method generally includes the steps of: (a) depositing a composition comprising nanoparticles of an electrically functional material such that it contacts first and second elements of the circuit; and (b) sufficiently irradiating at least part of the composition with light to fuse or bind the nanoparticles to each other. The composition and ink generally comprise such nanoparticles and a sensitizer having a light absorption maximum at a wavelength different from that of the nanoparticles. The apparatus comprises: (1) a deposition apparatus configured to deposit a liquid film of an electrically functional material on the circuit; (2) a light source configured to irradiate at least part of the thin film; and (3) a table configured to secure the substrate. The structure generally comprises a circuit element having an electrical disconnect, and a cured electrically functional material (i) in electrical contact with first and second locations on the circuit elements adjacent to the disconnect, and (ii) forming a continuous electrical path between the disconnected circuit portions. The present invention provides a fast, reliable method for repairing electrical circuits. The repair structures have electrical properties similar to the corresponding bulk or sheet materials. The invention is well suited for use with existing circuit inspection and testing equipment, thereby providing a 'one tool' solution to testing and repairing electrical circuits.

Growing community of inventors

San Carlos, CA, United States of America

J Devin MacKenzie