Advanced Micro Devices Corporation

J Courtney Black

Richard C Blish

Mohammad Massoodi

Colin D Hatchard

Mehrdad Mahanpour

Susan Xia Li

S Sidharth

David S Lehtonen

Don Carlos Darling

Richard C Blish Ii

An apparatus for x-raying a semiconductor device which includes semiconductor material and conductive material, the apparatus including a source of x-rays, a filter for receiving x-rays from the source of x-rays and allowing transmission of x-rays to the device, the filter having an atomic number greater than the atomic number of the conductive material of the device, and an x-ray imager for receiving x-rays from the device.

Prevention of parametic or functional changes to silicon semiconductor device properties during x-ray inspection

A system and method for detecting a location of a short in a flip-chip device is disclosed. The flip-chip device includes a semiconductor die and a substrate. The semiconductor die has an active area including a surface. The semiconductor die also has a plurality of connections coupled with the surface of the active area. The method and system include supplying power to the semiconductor die and sensing a temperature at a plurality of locations while power is supplied to the semiconductor die. The temperature is sensed at the plurality of locations using at least one thermal couple. The plurality of locations is disposed between the plurality of connections.

Method and system for utilizing multiple thermocouples to obtain a temperature contour map

A system and method for identifying a location of a short in a circuit of a semiconductor device is disclosed. The method and system includes providing a power supply and providing a power distribution network coupled to the power supply. The power distribution network is for distributing power to a portion of the circuit. The power distribution network further including means for selectively disconnecting a portion of the power distribution network. The portion of the power distribution network supplies power to the location of the short.

Method and system for selectively disconnecting a redundant power distribution network to indentify a site of a short

Method for implementing a multi-phase plastic package for electronic components, and packaged electronic components produced according to the method. The present invention contemplates the use of molding compounds having two or more discrete phases in a transfer molding process wherein a temperature differential is induced between the electronic component to be packaged and the mold of the molding apparatus prior to molding. Each of the molding compound phases, when used in a current transfer molding apparatus, generates a separate layer in the resultant package, and each of the resultant layers possesses certain unique properties. In its simplest implementation, the present invention provides a two-phase molding compound pellet which provides an outer layer containing mold release compounds to facilitate release of the completed packaged device from the mold, and an inner layer without mold release agents. Other implementations include multiple layers. One such implementation provides for an inner layer without flame retardants and a layer exterior to the inner layer containing flame retardants. In this manner, chemical interaction between the flame retardants and the encapsulated device is precluded. Other adjuncts may, with equal facility, be implemented in such additional layers as a given application may require.

Encapsulation method using non-homogeneous molding compound pellets

A system and method for detecting a position of a short in a semiconductor device is disclosed. The semiconductor device includes a semiconductor die and a substrate. The method and system include supplying alternating power to the semiconductor device. The method and system further include sensing a plurality of synchronous temperature variations in proximity to a surface of the semiconductor die while power is supplied to the semiconductor die.

Method and system for detecting faults utilizing an AC power supply

Aspects for device and package separation of a multi-layer integrated circuit device attached at a frontside to an integrated circuit package are described. In an exemplary method aspect, the method includes slicing through material coupling the multi-layer integrated circuit to the integrated circuit package with a high power water stream. The slicing further includes cutting through solder bump material. Additionally, the multi-layer integrated circuit device is utilized for device analysis from a frontside following separation from the integrated circuit package by the step of slicing.

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San Jose, CA, United States of America

J Courtney Black