Silicon Laboratories Inc.

J A Bolton

Yan Zhou

David S Trager

Guner Arslan

Vitor Pereira

Jeffrey A Tindle

Trenton John Grale

John B Youngblood

Die-to-die communication links for receiver integrated circuit dies within multi-die systems and related methods are disclosed for radio frequency (RF) receivers. The disclosed embodiments provide die-to-die communication links that allow for direct communication of operating parameters between receiver integrated circuit dies and other integrated circuit dies within a multi-die system so that the operation of receive path circuitry can be adjusted without requiring intervention from an external host processor integrated circuit. A variety of operating parameter information can be communicated through the die-to-die communication links so that the integrated circuit dies can quickly adjust to changing signal conditions without requiring intervention by the external host processor integrated circuit.

Die-to-die communication links for receiver integrated circuit dies and related methods

Growing community of inventors

Round Rock, TX, United States of America

J A Bolton