Infineon Technologies Ag

Continental Automotive Gmbh

Vitesco Technologies Gmbh

Jürgen Zacherl

Martin Reiss

Erich Mattmann

Gerhard Wild

Waldemar Brinkis

Michael Krempl

A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

Method for through-plating a printed circuit board and such a printed circuit board

A device and a method for detecting seat occupancy, with the device including first and second sensor elements associated with a respective seat surface. First and second weight-dependent sensor signals are electrically obtainable from the sensor elements. The seat occupancy is determined by taking either the first or the second sensor signals in dependence on an ambient temperature.

Device and method for detecting seat occupancy

The invention relates to an electronic device and a leadframe and to methods for producing the electronic device and the leadframe. The electronic device has a semiconductor chip with a top side fixed on a rewiring plate by a double-sided adhesive film. The underside of the rewiring plate has an edge region with through openings. The through openings are filled with a plastics compound that holds together the semiconductor chip and the rewiring plate by acting as a mechanical clip.

Electronic device and leadframe and methods for producing the electronic device and the leadframe

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Donaustauf, Germany

Jürgen Zacherl