Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Izuru Nakai

Toshiharu Okada

Shinji Nakamura

Toshihiro Nishii

Shigeru Yamane

Haruhiro Yuki

Ken Muneyuki

Hidenori Hayashi

Toru Fujimoto

Masahiro Mori

Koji Funami

Yuji Uesugi

Yukio Nishikawa

Hiroshi Takasaki

Takayuki Yoshida

Kazumichi Shimizu

Seiji Kumazawa

Keiichiro Masuko

Takaaki Kassai

Kenji Kasai

Hirotaka Katayama

Kazuki Fujiwara

Toshiharu Kimura

Daiji Kanematsu

Takeshi Fujishima

An evaluation method for evaluating laser machining in which irradiation region of a laser beam is moved relative to object to perform machining of object, includes a measurement step and an evaluation step. In the measurement step, a change in an intensity of light according to a movement of measurement region is measured by moving measurement region for measuring the intensity of light, relative to object. In the evaluation step, an evaluation of the laser machining is performed based on the change in the intensity of light according to the movement of measurement region. In the measurement step, measurement region is moved relative to object so that movement path of measurement region has a plurality of intersections with movement path of irradiation region.

Evaluation method, evaluation system, and laser machining system

A laser processing apparatus includes a light source configured to emit laser light; a power supply configured to supply a current to the light source; a deflection unit on an optical path of the laser light and including an optical element configured to change an amount of transmission of the laser light to deflect at least a part of the laser light; an optical separation unit on the optical path of the laser light and being configured to shield higher-order light included in the laser light and deflected by the optical element in the deflection unit, and transmit zero-order light that is included in the laser light and passes through the deflection unit; and a signal synchronization unit configured to control the power supply to selectively turn the current on or off in synchronization with a timing at which the higher-order light is deflected by the optical element.

Laser processing apparatus

A cylindrical battery includes an electrode unit configured as a roll of a first electrode plate and a second electrode plate with a separator in between. The first electrode plate is an electrode plate to which one end of a first electrode tab and one end of a second electrode tab are connected, and the second electrode plate has the opposite polarity from the first electrode plate. Additionally, a case houses the electrode unit and a sealing member seals an opening rim of the case. The first electrode tab and the second electrode tab are disposed to project out from the first electrode plate at opposite ends of a winding axis of the first electrode plate. The first electrode tab contacts at a bottom portion of the case and the second electrode tab is welded at the opening rim side opposite the bottom portion of the case.

Cylindrical battery and method of manufacture thereof

A solar cell () includes a semiconductor substrate () having a light-receiving surface () and a back surface (); an n-type semiconductor layer () and a p-type semiconductor layer () provided on the back surface () of the semiconductor substrate (), the n-type semiconductor layer () and the p-type semiconductor layer () extending in a first direction and being adjacent to each other in a second direction intersecting with the first direction; and a ground layer () provided on the n-type semiconductor layer () and the p-type semiconductor layer (). The ground layer () includes an n-side ground layer () and a p-side ground layer () separated from each other by a first separating groove () having a first separating portion () and a second separating portion () as well as a first bridge portion () separating the first separating portion () and the second separating portion (). The first bridge portion () separates the first separating portion () and the second separating portion () at at least one of a border on the n-side ground layer () or a border on the p-side ground layer () in the first direction.

Solar cell, and method for manufacturing solar cell

By irradiating laser lightobliquely onto a substrate, the laser soldering apparatus reduces the laser light passing through an insertion holein the substrateand prevents damage to low-heat-resistance portions of a componentdisposed on the rear surface side of the substrate. Moreover, the substratecan be observed from a normal direction with a camera. Therefore, even if the insertion holefor inserting a component lead or the like is provided in the substrate, the laser light does not leak out to the side of a component mounting surfaceof the substrate

Laser soldering apparatus

A light source () and a connection base () are held with a predetermined gap, solder paste melted by the thermal energy of laser light is fed into the gap, and the light source () and the connection base () are bonded together via a solder layer ().

Method of bonding an optical component

In an optical component where fixation of resin welding is performed by emitting a laser beam to screwing parts of an inner lens barrel and an outer lens barrel after focus adjustment, the laser beam is emitted to melt and cure a joint of the screwing part of the inner lens barrel and the screwing part of the outer lens barrel by 0.5 mm to 3.0 mm in a direction parallel to a direction of protrusion of the inner lens barrel relative to the outer lens barrel, so that welding and fixation are completed.

Manufacturing method of optical component and camera module

When drilling a multi layered sheet-like material, drilling is first made with pulses having energy that generates an inter-layer pull-off force smaller than the adhesion force between the layers. Then pulses with higher energy are radiated for trimming the shape of the holes, and thus through-holes having a desired shape are drilled without causing delamination of the layers.

Laser drilling

In a laser processing apparatus including a laser oscillator for emitting laser light onto a workpiece through an f&thgr; lens for drilling a hole in the workpiece, a wavelength selector for passing only a light ray having a specific wavelength is disposed between the laser oscillator and the workpiece.

Laser processing apparatus and method

In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Printed wiring board, and method and apparatus for manufacturing the same

In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

In a laser processing apparatus, laser beams are respectively focused and irradiated by focusing devices onto a work being processed, thereby performing laser processing in processing areas B within predetermined ranges on the work. An adjustment member is provided for automatically adjusting an interval C between the center points of the focusing devices in correspondence with the size of an entire processing area A on the work being processed.

Printed wiring board

A holding member is set, which sucks at a contact face, only a part of the periphery of a process area of a sheet-like article to hold the article. The holding member and the sheet-like article are moved relatively in such manner that the contact face is not physically in touch with an already processed area while the contact face maintains its suction to the sheet-like article. A deformation of the already processed area or a mixture of foreign articles to the already processed area can be prevented.

Apparatus and method for processing

A laser processing method is to be executed by a pair of turning mirrors of which axes of rotation are arranged in mutually twisted positions, a flat field lens for converging a laser beam reflected on the pair of turning mirrors on a specified plane, and an X-Y stage which carries and moves thereon an object to be processed to which the laser beam is applied, the object having a plurality of rectangular planar areas of the same shape as each other in a matrix form and adjoining the rectangular planar areas while not overlapping the rectangular planer area nor leaving any space therebetween. The method includes a first step of executing application of the laser beam of which a laser applying position is determined by the pair of turning mirrors and the flat field lens to one of the rectangular planar areas of the object, a second step of moving an X-axis stage or a Y-axis stage of the X-Y stage after the first step is completed, a third step of executing application of the laser beam to one of the rectangular planar areas which is adjacent to the rectangular planar area to which the latest application of the laser beam is performed, and a fourth step of executing the second and third steps alternately to process the plurality of rectangular planar areas of the object.

Growing community of inventors

Toyonaka, Japan

Izuru Nakai