Kabushiki Kaisha Toshiba

Other

Osaka University

Toshiba Lighting & Technology Corporation

Kuroda Denki Kabushiki Kaisha

Izuru Komatsu

Masahiro Tadauchi

Kouichi Teshima

Michinobu Inoue

Kazuhito Higuchi

Takeshi Gotanda

Kazuo Shimokawa

Tomohiro Iguchi

Akihiko Happoya

Daigo Suzuki

Kazuki Tateyama

Mitsuhiro Tomita

Tomiaki Furuya

Kazutaka Matsumoto

Yoshiyuki Goto

Hisashi Ito

Hiroshi Tateishi

Takashi Koyanagawa

Tetsuji Hori

Makoto Gonda

Makoto Sakai

Takayuki Suzuki

Hideo Nishiuchi

Keiichiro Matsuo

Takumi Suwa

Cao Minh Thai

Shinji Nakata

Satoru Asagiri

Yasuhide Okada

Haruka Yamamoto

Kazuya Yamamura

Koichi Teshima

Rikiya Katoh

Yuji Ohkubo

Kumiko Ioka

Hajime Nakashima

Jun Sugimoto

Mitsuyoshi Hirayama

Erika Miyake

A power module includes a base plate, a casing, a substrate unit, a terminal plate, a first resin layer, and a second resin layer. The substrate unit includes a substrate fixed on the base plate, a dam part, a semiconductor chip, a metal member, and a wire. The dam part is formed along an edge of the substrate. The wire includes an electrode plate connection portion, and a chip connection portion. The first resin layer is located inward of the dam part. The chip connection portion and the electrode plate connection portion are located inside the first resin layer. The second resin layer is located on the first resin layer. The upper surface of the metal member is located inside the second resin layer. An elastic modulus of the second resin layer is less than that of the first resin layer.

Power module

Provided is a laminated body that has high adhesiveness between a resin body containing a fluorine-based resin and a silicone gel and that can be attached to and detached from an adherend for use. A laminated body comprising: a resin body; and a gel body, wherein the resin body comprises a fluorine-based resin, and the gel body comprises a silicone gel and lipophilic silica particles.

Laminated body including resin body and gel body and method for producing same

A housing according to the embodiment includes a lower surface part, an upper surface part, and a side surface part. The lower surface part includes a contact surface contacting an adherend. The upper surface part is separated in a vertical direction from the lower surface part with a first space interposed. The side surface part is provided around the first space and is connected to the upper surface part and the lower surface part. The upper surface part and the side surface part include a first material. The lower surface part includes a second material that is softer than the first material. A portion that includes the second material is exposed for at least a portion of the contact surface.

Housing, electronic device, method for manufacturing housing, and method for manufacturing electronic device

According to an embodiment, a structure is provided. The structure comprises a silicone formed product, water, and a protective member. The silicone formed product contains hydroxyl groups in at least a portion of a surface. The water is in contact with at least the portion of the surface containing the hydroxyl groups. The protective member retains the water.

Structure, wiring board, substrate for wiring board, copper clad laminate, and method for manufacturing the structure

According to one embodiment, the illuminating device of the embodiment has a base part and multiple light emitting elements; the illuminating device includes a supporting part, which is arranged on one end of the base part, and which at least partially encloses an internal space. The supporting part also has an outer surface exposed to the ambient atmosphere. The multiple light emitting elements are disposed on the inner surface side of the supporting part so that at least light emitting surfaces of the light emitting elements are in contact with the supporting part.

Illuminating device

A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe.

Luminaire

An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

Optical semiconductor device and method of manufacturing optical semiconductor device

The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.

Thermosetting flux and solder paste

A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.

Mounting material, semiconductor device and method of manufacturing semiconductor device

Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.

Solder material, device using the same and manufacturing process thereof

Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

Soldering method and soldering apparatus

Disclosed is a solder material and a manufacturing method thereof. The solder material has a first layer composed of a first metallic material and a second layer composed of a second metallic material which is different from the first metallic material, the first layer being formed in an elongated shape having axiality, and the second layer covering the first layer to surround the axis of the first layer. The solder material is in a form of a wire, a granule, a sheet, a tape or a planar fragment. The manufacturing method includes: covering a first metallic material with a second metallic material which is different from the first metallic material to prepare a covered body; and rolling the covered body to prepare a solder material comprising a first layer formed of the first metallic material in an elongated shape having axiality and a second layer covering the first layer to surround an axis of the first layer. The solder material may be cut to granulate the solder material, and the second layer can be deformed during or after cutting.

Solder material and method of manufacturing solder material

Disclosed is a method of joining metallic members together. The metallic members are coated with an undercoat composed of an alloy of tin and zinc and contacted with each other through a mixture containing a solder comprising tin and zinc and a flux, while heating the metallic members to melt the solder. Then the molten solder is solidified to join the metallic members. Here, the ratio of zinc in the undercoat is represented by x (% by weight), the ratio of zinc in the solder is represented by y (% by weight), and the ratio, x, and the ratio, y, are values within an area enclosed by the line A or B in FIG.,which satisfies the formulas: 1&lE;x&lE;20, 3&lE;y&lE;13 and 3&lE;(x&plus;y)/2&lE;13, or formulas: 0.1&lE;x&lE;25, 2&lE;y&lE;15 and 2&lE;(x&plus;y)/2&lE;15.

Method of joining metallic members, and joined metallic members

Growing community of inventors

Yokohama, Japan

Izuru Komatsu