Ngk Insulators, Inc.

Izumi Masuda

Takeshi Kaku

Takaaki Koizumi

Takashi Ebigase

Masayuki Uetani

Naoki Ogawa

The bonded substrate includes the silicon nitride ceramic substrate, a copper plate, the bonding layer, and penetrating regions. The copper plate and the bonding layer are patterned into a predetermined shape, and are disposed over a main surface of the silicon nitride ceramic substrate. The bonding layer bonds the copper plate to the main surface of the silicon nitride ceramic substrate. The penetrating regions each include one or more penetrating portions penetrating continuously from the main surface of the substrate into the silicon nitride ceramic substrate to a depth of 3 μm or more and 20 μm or less, and contain silver, and the number of penetrating regions present per square millimeter of the main surface of the substrate is one or more and 30 or less.

Bonded substrate and bonded substrate manufacturing method

A second main surface of the copper plate is opposite a first main surface of the copper plate, and is bonded to a silicon nitride ceramic substrate by the bonding layer. A first portion and a second portion of an end surface of the copper plate form an angle of 135° to 165° on an outside of the copper plate. An extended plane of the first portion and the second main surface form an angle of 110° to 145° a side where the second portion is located. A distance from the second main surface to an intersection of the first portion and the second portion in a direction of a thickness of the copper plate is 10 to 100 μm. The second main surface extends beyond the extended plane of the first portion by a distance of 10 μm or more.

Bonded substrate and manufacturing method of bonded substrate

A piezoelectric device is a fired body including a body partand external electrodesandA surface of the side electrodeis comprised only of a material for the side electrodeOn a surface of the surface electrodeor a surface of a connection portion where the surface electrodeand the side electrodeare connected to each other, a protrusion h extending along a direction along which the connection portion extends and sticking out in a thickness direction of the surface electrodeis provided. A region, on the surface of the surface electrodefarther from the connection portion than the protrusion h is interspersed with a plurality of exposed portions in each of which a surface of a ceramic material having lower solder wettability than a material for the surface electrodeis exposed.

Ceramic device and piezoelectric device

A laminated body has a substrate and a metallic layer. The substrate is composed of an inorganic material. The metallic layer is disposed on the substrate. One of the substrate and the metallic layer has a main body portion and a plurality of protruding portions. The protruding portions are formed on the main body portion. The protruding portions are embedded in the other of the substrate and the metallic layer. An outer diameter of each of the protruding portions is configured to decrease towards the main body portion.

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Kitanagoya, Japan

Izumi Masuda