Fujitsu Corporation

Fujitsu Semiconductor Limited

Fujitsu Microelectronics Limited

Izumi Kobayashi

Susumu Moriya

Toshiyuki Honda

Naoyuki Watanabe

Hiroshi Aoki

Masanori Onodera

Yoshito Akutagawa

Takao Ohno

Takanori Watanabe

Kazuto Tsuji

Shigeo Iriguchi

Noboru Hayasaka

Koji Sawahata

Masashi Takenaka

Keiji Mizuma

Katsuro Hiraiwa

Hiroshi Kaiya

An image pickup device is disclosed that has little deformation caused by thermal expansion of a transparent resin for sealing an image pickup element. The image pickup device includes an image pickup element having a light receiving surface, a micro-lens for condensing incident light to the image pickup element, a first transparent plate disposed on the light receiving surface of the image pickup element with the micro-lens in between, a transparent resin that seals the image pickup element and the first transparent plate, and a second transparent plate disposed on the transparent resin to face the first transparent plate.

Image pickup device and production method thereof

An imaging device includes an image sensing device provided on a semiconductor substrate; a transparent member provided on a light-receiving area of the image sensing device; and a circuit element provided on the transparent member, wherein the image sensing device and the circuit element are electrically coupled to each other.

Imaging device

A solid-state imaging device includes: a solid-state imaging element having a light-receiving area; a transparent member disposed so as to oppose the light-receiving area; a supporting member configured to support the transparent member; a first mark disposed at either an upper surface of the transparent member or an upper surface of the supporting member; and a second mark disposed at an outer side of the light-receiving area, at an upper surface of the solid-state imaging element.

Solid-state imaging device and method of fabricating solid-state imaging device

A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Method of resin sealing electronic part

A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filter fixing portion.

Camera module equipped with an optical filter having an edge not in contact with a fixing portion

An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.

Image capturing device

In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case bodyso as to surround case body. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.

Imaging apparatus

In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

Camera module for compact electronic equipments

A semiconductor device includes a resin housing provided with a functional part, a wire pattern made of a conductive material and molded in the resin housing, a part of the wire pattern being exposed from the resin housing, an electronic part connected with the wire pattern in a state where the electronic parts is molded in the resin housing, and a semiconductor element connected to the part of the wire pattern being exposed from the resin housing. The semiconductor element provides a designated function in cooperation with a functional part of the resin housing.

Semiconductor device and method for making the same

An improved contactless integrated circuit (IC) card having one or more laminate members, a wire-wound coil provided on the laminate member for receiving power and for transmitting and receiving signals to and from an external device, and an IC module for inputting and outputting the signals, the wire-wound coil being coupled to the IC module, wherein the improvement comprises an end portion of the wire-wound coil being formed into a buffer portion near the point at which the wire-wound coil is coupled to the IC module so as to absorb tension generated in the wire-wound coil.

Contactless IC card

A call restriction system for an ATM exchange reduces the load on the call control processor and achieves a step-wise variation in the degree of call restriction in response to the degree of load in an ATM exchange. The exchange has at least one circuit interface section to which are connected a plurality of physical circuits The exchange terminates the physical circuits and a call control processor which is connected to the circuit interface section or sections and performs call-processing control. A signal control processing unit within the circuit interface section performs call restriction with respect to each individual physical circuit, either in response to an instruction from the call control processor or independently.

Growing community of inventors

Kawasaki, Japan

Izumi Kobayashi