Motorola Corporation

Iwona Turlik

Sanjar Ghaem

Cynthia M Melton

George N Demet

Yong Liu

Zili Li

Kevin W Jelley

Grace M O'Malley

George Amos Carson

Rudyard L Istvan

Tom Mathew

Lillian Charell Thompson

Di-An Hong

Weinin Xiao

Displays such as liquid crystal displays (), organic light emitting diode displays, and touch sensitive displays () are stacked with one or more solar cells () such that light passing through the displays will illuminate the light receiving active surface of the solar cells (). No reflector or polarizer need be used when the liquid crystal display () uses cholesteric or polymer dispersed liquid crystals. When using supertwist nematic or twisted nematic liquid crystals, a reflector () can be used that comprises a selective color reflector. The resultant display/solar cell can be utilized in combination with a device such as a wireless communications device () with the solar cell () providing electricity to the display (), the wireless communications device (), or both. A mask () can be used to occlude surface features on the solar cell () as appropriate to provide a substantially uniformly colored appearance.

Display and solar cell device

Brain response signals of a user, such as electroencephalogram signals, and in particular visually evoked potential signals that correspond to predetermined illumination patterns, are detected and utilized to ascertain selection of specific functions and/or actions as desired by that user. Sources of illumination that exhibit such patterns are arranged to physically correspond to indicia of such functions and actions to facilitate knowing selection thereof.

Brain response monitoring apparatus and method

An eye implant for treating glaucoma includes a main conduit and a plurality of anchor members formed from a first resilient material. The anchor members are formed such that they are biased to a relaxed condition in a non-aligned position relative to the conduit. To facilitate insertion of the implant into the eye in a minimally invasive surgical procedure, the anchor members are secured together in an aligned condition relative to the conduit with a bonding material. A cutting surface or element is also applied to the anchor members to allow the implant to be inserted directly through the wall of the sclera. The cutting surface is formed of a second material different from the first material. The second material is adapted to dissolve or melt after the implant has been inserted into the eye. Similarly, the bonding material holding the anchor members together in an aligned condition can be made from a dissolveable or heat sensitive material to allow the anchor members to relax to their non-aligned position after insertion into the eye. In the non-aligned position, the anchor members secure the implant to the wall of the sclera. Alternatively, the bonding material holding the anchors together could be made from a material that is ablated away with a laser after the implant has been inserted into the eye.

Eye implant for treating glaucoma and method for manufacturing same

A self-contained remotely interrogated biomedical sensor (,) includes an on-board regenerative power source (,), data processing capability (,) and data transmission capability (,). The sensor (,) is adapted to be secured to a subject and interrogated remotely using radio-frequency technology. The present invention is applicable for use with any sensing device (,) that is capable of providing a signal in response to being placed in thermal, electrical, chemical, acoustical or otherwise in contact with the subject.

Remotely interrogated biomedical sensor

A microelectronic package (,) is formed by placing a lead frame (,) onto an adhesive polyimide tape (,). The lead frame (,) includes a plurality of metallic leads (,) and an opening. An integrated circuit die (,) is positioned onto the molding support (,) within the opening such that a non-active face (,) of the integrated circuit die (,) rests against the molding support (,). Wire leads (,) connect an active face (,) of the integrated circuit die (,) to the metallic leads (,). A plurality of metallic bumps (,) are attached to the metallic leads (,), and a polymeric precursor is dispensed. The precursor embeds the active face (,) of the integrated circuit die (,), the inner surface (,) of the metallic leads (,), the wire leads (,), and the metallic bumps (,). The microelectronic package (,) is then heated to cure the polymeric precursor to form a polymeric body (,). The microelectronic package (,) is then capable of being tested and subsequently attached to printed circuit board (,) to form a low-profile microelectronic assembly (,).

Low-profile microelectronic package

A microelectronic assembly (10) includes a polymeric card (12) that includes a substantially planar major surface (18). An integrated circuit component (14) is embedded in the polymeric card (12) and has a first contact (20) and a second contact (22). An antenna element (16) is formed of a singular metallic strip and includes a first terminal (26) electrically connected to the first contact (20), a second terminal (28) electrically connected to the second contact (22), and a loop (30) intermediate the first terminal (26) and the second terminal (28). The first terminal (26) includes a first outer surface (32) and the second terminal (28) includes a second outer surface (34). The first outer surface (32) and the second outer surface (34) are exposed at the major surface (18) and are coextensive therewith. The loop (30) is embedded within the polymeric card (12) and spaced apart from the major surface (18).

Microelectronic assembly including an antenna element embedded within a

A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An integrated circuit die (12) is positioned onto the molding support (38) within the opening such that a non-active face (32) of the integrated circuit die (12) rests against the molding support (38). Wire leads (18) connect an active face (28) of the integrated circuit die (12) to the metallic leads (16). A plurality of metallic bumps (20) are attached to the metallic leads (16), and a polymeric precursor is dispensed. The precursor embeds the active face (28) of the integrated circuit die (12), the inner surface (19) of the metallic leads (16), the wire leads (18), and the metallic bumps (20). The microelectronic package (10) is then heated to cure the polymeric precursor to form a polymeric body (14). The microelectronic package (10) is then capable of being tested and subsequently attached to a printed circuit board (40) to form a low-profile microelectronic assembly (11).

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Barrington, IL, United States of America

Iwona Turlik