Kabushiki Kaisha Toshiba

Toyoda Gosei Co., Ltd.

Iwao Matsumoto

Hiroaki Oshio

Kazuhiro Inoue

Satoshi Shimizu

Teruo Takeuchi

Hidenori Egoshi

Satoshi Komoto

Tatsuo Tonedachi

Mitsuhiro Nawashiro

Tetsuya Muranaka

Masaki Adachi

Kazuhiro Tamura

Takeshi Miyakawa

Hiroshi Nagasawa

Tsuguo Uchino

Hatsuo Takezawa

Toshiaki Hosoya

Kenji Naito

Tadashi Umegi

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

LED package and method for manufacturing same

According to one embodiment, an LED package includes (2&#xd7;n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2&#xd7;n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2&#xd7;n) lead frames and another terminal connected to each of lead frames of the (2&#xd7;n) lead frames other than the n lead frames. The resin body covers the (2&#xd7;n) lead frames and the n LED chips.

LED package

A light emitting device includes: a light emitting element;

Light emitting device with a recess lead portion

In various aspects, a semiconductor light emitting device may include a mold resin having a cup shape portion on an upper surface of the mold resin; a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead, the second lead section of the first lead having a hole; a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead; a light emitting element mounted on the second section of the first lead in the cup shape portion; a wire electrically connecting the light emitting element and the second lead; and a sealing resin configured to seal the light emitting element and the wire.

Semiconductor light emitting device and semiconductor light emitting unit

A semiconductor light emitting device includes: a body having a recess, a step being provided on a side wall of the recess; a semiconductor light emitting element mounted in the recess; and a resin layer. The resin layer covers at least a portion of an inner surface of the recess of the body. The resin layer has a higher reflectivity than the inner surface of the recess of the body.

Semiconductor light emitting device

A semiconductor light emitting device comprises: embedding resin; a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin; a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin; a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and a wire connecting the semiconductor light emitting chip with the second lead. The first and second inner lead sections and the first and second outer lead sections each have a substantially coplanar rear face. At least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section are not covered with the embedding resin but are exposed.

A semiconductor light emitting device includes a semiconductor light emitting element (,), a resin stem (,) having a recess (,), and a projection (,) made of a light-transmissive thermosetting resin on the resin stem so as to cover the entire upper surface and continuous upper part of side surfaces of the resin stem to a predetermined depth. The recess is filled with a light-transmissive resin encapsulating element (,) to embed the semiconductor light emitting element, one end of an externally extended first lead (,) and one end of an externally extended second lead (,) electrically connected to first and second electrodes of the semiconductor light emitting element, and a bonding wires (,) connecting the second lead to the second electrode. The projection functions as a lens and is made by hardening a fluid-state resin in an encapsulating case mold. Since the projection extends over the upper surface and upper part of side surfaces continuous from the upper surface, it is firmly bonded to the resin stem with a high adherability.

Growing community of inventors

Fukuoka-ken, Japan

Iwao Matsumoto