Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Iwao Maekawa

Akira Kageyama

Takashi Masuko

Yasuo Miyadera

Masami Yusa

Shinji Takeda

Aizou Kaneda

Tooru Kikuchi

Mitsuo Yamasaki

Isao Uchigasaki

Akio Kotato

Makoto Saitou

Tadaji Satou

Noboru Monma

Mituo Yamasaki

Yuusuke Miyamae

Fumio Nakano

Seikichi Tanno

Daisuke Makino

Hidetaka Sato

Mitsuo Yamazaki

Hideyuki Tobita

Ren Ito

Eiji Omori

Tadashi Fuzii

Hirobumi Izumi

Tsutomu Toyoda

Naoki Yokoyama

Sakato Kumazaki

Tutomu Sarudate

Shouzi Takamizawa

Uchigasaki, Isao

Takeshi Tanno

A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250&#xb0; C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Semiconductor device and process for fabrication thereof

Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device

A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 Mpa or less at a temperature of 259&deg; C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Laminating method of film-shaped organic die-bonding material,

An electroconductive resin paste, comprising a resin obtained by reacting 0.01 to 0.5 carboxylic acid equivalent of a homopolymer or a copolymer of butadiene having carboxylic acid terminal groups with 1 epoxy equivalent of an epoxy resin having two or more epoxy groups in one molecule, a curing agent and an electroconductive filler which is (i) an electroconductive metal powder or (ii) an inorganic insulating powder coated with a surface electroconductive film, said electroconductive filler being in an amount of from 60 to 95% by weight based on the resin and the electroconductive filler.

Electroconductive resin paste

A coating composition comprising (A) a thermoplastic resin having a glass transition temperature of 0.degree. to 80.degree. C., (B) a compound having 2 or more hydroxyl groups in the molecule, (C) a thixotropic agent and (D) a solvent, and said coating composition having a viscosity of 3 to 50 poises at 25.degree. C. and a thixotropy of 2 or more can give a moistureproof insulating coating film with uniform and large thickness and very few bubbles by one-time treatment over packing circuit boards.

Moistureproof insulating coating composition for packing circuit boards

A method for the manufacture of a polybutadiene-modified unsaturated polyester, comprising the steps of: (I) reacting (A) an .alpha.,.beta.-unsaturated dicarboxylic acid or anhydride with (B) at least one compound selected from the group consisting of (i) air-drying allyl compounds, (ii) animal and vegetable oils or derivatives thereof and (iii) dicyclopentadiene or derivatives thereof at a (B)/(A) molar ratio within the range of from 0.8 to 1.2, and (II) reacting the resultant reaction product with (C) at least one compound selected from the group consisting of .alpha.,.omega.-polybutadiene glycol and .alpha.,.omega.-hydrogenated polybutadiene glycol. A polybutadiene-modified unsaturated polyester comprising said polybutadiene-modified unsaturated polyester and a polymerizable monomer possessing at least one double bond.

Method for manufacture of polybutadiene-modified unsaturated polyester

Resin composition

Polyimide-amide-carboxylic acids produced by reacting an aromatic diamine with an aromatic tetracarboxylic acid dianhydride in amounts of 1.5 to 2.0 moles of the latter per mole of the former in the presence of an inert solvent, and reacting the resulting intermediate reaction product with an aromatic diisocyanate in about equivalent amounts at a temperature of 50.degree. to 100.degree. C. while removing generated carbon dioxide from the reaction system are good in heat resistance, wear resistance, chemical resistance, etc.

Process for producing polyimide-amide-carboxylic acid

An oligomer having, as the constitutional component thereof, (dihydrodicyclopentadienyl)-maleates or -fumarates of the general formula I: ##STR1##           (I) wherein, R is H or ##STR2## and possessing a softening point in the range of from 50.degree. to 180.degree. C. and solubility in organic solvents. It is obtained by polymerizing the compound having the above general formula I under heating at a temperature of 220.degree. to 300.degree. C. in the absence of a catalyst.

Oligomers and a method for the manufacture thereof

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Hitachi, Japan

Iwao Maekawa