Mitsubishi Electric Corporation

Iwao Katsuno

Yasuhiro Suzuki

Takayuki Inuzuka

Akihiro Fujita

Yuhei Awano

Kosei Tsuji

Tomonori Abe

Hideo Iinuma

Mitsuaki Nakata

Kazuhiko Yamashita

The present invention is an electronic device unit including an electronic device that has air inlets formed on a bottom surface of a main housing body having electronic components housed therein, and that introduces air to an inner part of the main housing body through the air inlets to cool the inner part of the main housing body, and a battery pack that is attached to the main housing body in a state where a battery case covers a part of a portion being an extensional region of the air inlets, wherein a surrounding wall part is provided on the bottom surface of the main housing body to surround a ventilation region in which the air inlets are provided and to be open at a portion facing the ventilation region, and the battery case is attached to the main housing body via protruding ends of the surrounding wall part.

Electronic device unit and electronic device

A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first lead frame and the second lead frame from the primary molding resin portion, a hook-and-hold portion for preventing separation of the first lead frame from the primary molding resin portion and separation of the second lead frame from the primary molding resin portion is provided on an outer surface of each of the first lead frame and the second lead frame. Thus, a resin molding part capable of achieving suppression of increase in a thickness thereof without deformation or displacement of a lead frame and a manufacturing method thereof can be provided.

Resin molding part and manufacturing method thereof

Growing community of inventors

Tokyo, Japan

Iwao Katsuno