Taiyo Yuden Co., Ltd.

Iwao Fujikawa

Kazuhiko Otsuka

Takayuki Uehara

Nobuo Mamada

Nobuyasu Shiba

Hideo Aoba

Nobuhiro Umeyama

Katsuo Koizumi

Yoshihiro Amada

Kazuyuki Shibuya

Masayuki Shimizu

One inventive aspect relates to a laminated capacitor capable of satisfying higher electrostatic capacitance and lower ESL at the same time. A dielectric chip constituting the laminated capacitor has an integral structure formed by alternately laminating a pair of first inner conductor layer and second inner conductor layer which are positioned on the same plane and are held in a non-contact relation, and a pair of third inner conductor layer and fourth inner conductor layer which are positioned on the same plane and are held in a non-contact relation, while a dielectric layer is interposed between the pair of first and second inner conductor layers and the pair of third and fourth inner conductor layers. Voltage of one polarity is applied to the first and fourth inner conductor layers from a first outer electrode through lead-out portions, and voltage of the other polarity is applied to the second and third inner conductor layers from a second outer electrode through lead-out portions.

Laminated capacitor having laminated internal conductor layers with lead out portions on side areas thereof

A wire wound electronic component of the present invention includes a bobbin having a core having a substantially circular cross-section and rectangular flanges formed at both ends of the core. A groove is formed in each side of each flange A conductive film or external electrode is formed on each flange A coil or wire is wound round the core and has a conductor protruding from opposite stripped ends thereof. The opposite ends of the conductor are respectively received in the grooves of the flanges and connected to the conductive films A coating or armor is formed on the coil and has a flat surface The coating has a rectangular configuration complementary to the configuration of the flanges

Method of manufacturing wire wound electronic component

A wire wound electronic component includes a bobbin having a core having a substantially circular cross-section and rectangular flanges formed at both ends of the core. A groove is formed in each side of each flange . A conductive film or external electrode is formed on each flange . A coil or wire is wound round the core and has a conductor protruding from opposite stripped ends thereof. The opposite ends of the conductor are respectively received in the grooves of the flanges and connected to the conductive films . A coating or armor is formed on the coil and has a flat surface . The coating has a rectangular configuration complementary to the configuration of the flanges

A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular figuration complementary to the configuration of the flanges 1b.

Growing community of inventors

Tokyo, Japan

Iwao Fujikawa