Soleras Advanced Coatings Bv

Soleras Advanced Coatings Bvba

Bekaert Advanced Coatings

Bekaert Advanced Coatings Nv.

Ivan Van De Putte

Wilmert De Bosscher

Niek Dewilde

Guy Gobin

Ignacio Caretti Giangaspro

Koen Corteville

Parsifal Goderis

Koen Staelens

A method of depositing a layer on a piece by sputter deposition, a coater and a processor for controlling a coater in accordance with the method are provided. The method includes providing deposition of metallic and reactive species simultaneously on a piece for forming a layer under predetermined sputtering conditions, thereby providing a deposited layer on the piece comprising a metal compound. The deposited layer is subsequently irradiated and the optical transmittance is measured. A measured parameter related to the measured radiation is compared with one stored value of that parameter. The sputtering conditions are thereby adapted as a result of the comparison.

Deposition of non-stoichiometric metal compound layer

A cover for a configurable measuring system of a configurable sputtering system which is adapted for sputtering multilayer coatings with varying compositions and comprising a plurality of sputtering zones and having a plurality of apertures on which the cover is detachably attachable, and wherein the cover comprises a sensor system for in situ detection of a property of the multilayer coating on a substrate, wherein said at least one sensor system is attached to the cover.

Cover with a sensor system for a configurable measuring system for a configurable sputtering system

A movement system is provided for moving a non-flat substrate across a sputter flux distribution without circumferentially exposing the non-flat substrate to the sputter flux distribution. The movement system is arranged for a first movement of translationally transporting the non-flat substrate along the sputter flux distribution, and a second movement of translating and/or rotating the non-flat substrate with respect to the sputter flux distribution.

Movement systems for sputter coating of non-flat substrates

A feedback system for controlling properties of a single layer or multiple layer stack is applied on a substrate by means of a vacuum coating process controlled by a plurality of process controlling means. The system includes at least one monitoring device for at least implementing at least two distinct measurement techniques for determining measurement signals at each of a plurality of locations spatially distributed over the coated substrate; at least one processing unit adapted for at least receiving the measurement signals; and a controller for at least providing actuation signals for actuating the plurality of process controlling means.

Feedback system

A power transfer system is described for transfer of electrical power to a sputter target in a sputter device. It comprises a first part comprising a contact surface positionable against a first part of an endblock of the sputter device, a second part inseparably connected to the first part and a third part, and a third part comprising a contact surface positionable against a second part of the endblock or directly against a sputter target when mounted on the endblock. At least two of the three parts are formed as one monolithic piece. One of the parts of the power transfer system is resilient such that, when mounted, the power transfer system is clamped between the first part of the endblock and the second part of the endblock or the sputter target. This part is also responsible for the transfer of electrical power.

Electrical transfer in an endblock for a sputter device

A sputter device for depositing a layer on a substrate in a vacuum chamber and having a layer property in each point of the substrate surface. The sputter device comprises at least one end block adapted for holding a cylindrical target having a longitudinal axis in a first direction, and a first drive means for providing a rotational movement of the at least one cylindrical target around its longitudinal axis. The sputter device includes a second drive means for applying a translational movement to an end block in a second direction. The first and the second drive means are adapted for, during sputtering, being simultaneously operational in the vacuum chamber. The movement of the first drive means does not impact the uniformity of the layer sputtered on the substrate in the direction on the surface of the substrate corresponding to a perpendicular projection of the second direction onto the substrate.

Sputter device with moving target

A device for use in a sputter system, comprising at least a first end block and a second end block positioned at opposite sides of the sputter system. The device is adapted such that a target assembly comprising at least one target tube or sputter magnetron, when mounted on the first and second end blocks, may be powered actively with RF power at both sides of the assembly, and such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron. An assembly comprising said device and a control unit for controlling powering of opposite sides of the target assembly by RF power such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron.

Device having two end blocks, an assembly and a sputter system comprising same, and a method of providing RF power to a target assembly using said device or assembly

An end-block for rotatably carrying a sputtering target tube and for rotatably restraining a magnet bar inside the sputtering target tube includes a receptacle for receiving a magnet bar fitting. The receptacle comprises a first part of a signal connector arranged to receive a second part of a signal connector from the magnet bar fitting, and allow a signal connector between the end-block and the magnet bar to be formed. The end-block is adapted for providing protection means to the signal connector for protecting it from degradation, destruction or interference of a power and/or data signal transmitted between the end-block and the magnet bar, due to surrounding cooling fluid and/or surrounding high energy fields. The disclosure provides a corresponding magnet bar, and a method for adjusting a magnetic configuration of a magnet bar in a cylindrical sputtering apparatus.

Online adjustable magnet bar

A sputtering magnetron () insertable in a rotatable target is described. The magnetron is designed around a single piece, multiwalled tube () with compartments (') extending over the length of the tube. The multiwalled tube gives a much stiffer magnetron carrier structure compared to prior art magnetrons. As a result, the magnetic field generator can be mounted inside a compartment and the distance between magnets and target surface is easily adjustable as the tube is much stiffer than the generator. Additionally, the coolant channels can be incorporated inside the tube and close to the outer wall of the tube so that coolant can be supplied in the vicinity of the magnetic field generator. The increased stiffness of the magnetron allows the target tube to be carried by the magnetron&#x2014;not the other way around&#x2014;at least during part of the useful life of the target. As a result thin target carrier tubes can be used as they don't have to carry the magnetron anymore resulting in a longer use of the target.

Rotatable sputtering magnetron with high stiffness

A module to carry targets in a sputter deposition installation for coating two-sided substrates is described. The module is mountable to the installation through an interface flange that carries at least two targets with their associated magnet systems. When the module is mounted, the targets take positions at opposite sides of the two-sided substrate, while the magnet systems orient the sputter deposition towards the substrate. The module enables coating of both sides of the substrate in one single pass. Different configurations are described with gas distribution systems and additional substrate supports. An enclosure with adjustable blinds in order to reduce gas spreading is also included.

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Waregem, Belgium

Ivan Van De Putte